Photo of Yu-Cheng Lin

View Scopus Profile

Yu-Cheng Lin

Professor

  • 2904 Citations
  • 30 h-Index
19942019
If you made any changes in Pure these will be visible here soon.

Research Output 1994 2019

Filter
Review article
2006
14 Citations (Scopus)

Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions

Wang, T. H., Lee, C. C., Lai, Y. S. & Lin, Y. C., 2006 Sep 1, In : Journal of Electronic Packaging, Transactions of the ASME. 128, 3, p. 281-284 4 p.

Research output: Contribution to journal › Review article

Chip scale packages
Thermal cycling
Printed circuit boards
Thermoanalysis
Boundary conditions