Research Output per year
Research Output 1994 2019
2006
14
Citations
(Scopus)
Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions
Wang, T. H., Lee, C. C., Lai, Y. S. & Lin, Y. C., 2006 Sep 1, In : Journal of Electronic Packaging, Transactions of the ASME. 128, 3, p. 281-284 4 p.Research output: Contribution to journal › Review article
Chip scale packages
Thermal cycling
Printed circuit boards
Thermoanalysis
Boundary conditions