Yu-Cheng Lin – Research output — National Cheng Kung University

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127 Article
68 Conference contribution
9 Patent
7 Conference article
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2006
Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions
Wang, T. H., Lee, C. C., Lai, Y. S. & Lin, Y. C., 2006 Sept 1, In: Journal of Electronic Packaging, Transactions of the ASME. 128, 3, p. 281-284 4 p.
Research output: Contribution to journal › Review article › peer-review
14 Citations (Scopus)