Yu-Cheng Lin


  • 2939 Citations
  • 30 h-Index
1994 …2020
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Research Output 1994 2020

Review article
14 Citations (Scopus)

Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions

Wang, T. H., Lee, C. C., Lai, Y. S. & Lin, Y. C., 2006 Sep 1, In : Journal of Electronic Packaging, Transactions of the ASME. 128, 3, p. 281-284 4 p.

Research output: Contribution to journalReview article

Chip scale packages
Thermal cycling
Printed circuit boards
Boundary conditions