多晶片模組電子構裝製程技術-多晶片模組電子構裝製程技術-子計畫三:多晶片模組之散熱與接腳熱應力關係之研究 II

  • Chou, Jung-Hua (PI)

Project: Research project

Project Details

StatusFinished
Effective start/end date95-08-0196-07-31