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奈米壓痕技術應用於評估多層堆疊直通矽晶穿孔元件(TSV)之熱電失效與分析模型建立
Lin, Jen-Fin
(PI)
Department of Mechanical Engineering
Project
:
Research project
Overview
Project Details
Status
Finished
Effective start/end date
17-08-01
→
18-07-31
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