| Translated title of the contribution | Finding the Key Factors for the Multiple-Response Manufacturing Process-Using a Solder Paste Stencil Printing Process as an Example |
|---|---|
| Original language | Chinese |
| Pages (from-to) | 435-455 |
| Journal | Journal of Quality |
| Volume | 14 |
| Issue number | 4 |
| Publication status | Published - 2007 Dec 1 |
具多重反應值製程之要因分析－以電路板塑料方型扁平式封裝為例
Jeh-Nan Pan, Chen Ji-Ja
Research output: Contribution to journal › Article › peer-review