| Translated title of the contribution | Method of thermosonic wire bonding process for copper connection in a chip |
|---|---|
| Original language | Chinese (Traditional) |
| Patent number | I221026 |
| IPC | H01L-023/49 |
| Priority date | 22-12-05 |
| Filing date | 02-12-06 |
| Publication status | Published - 2004 Sept 11 |
具銅導線晶片之銲線製程方法
Yeau-Ren Jeng (Inventor), 王 章銘 (Inventor)
Research output: Patent