| Translated title of the contribution | Method of thermosonic wire bonding process for copper connection in a chip |
|---|---|
| Original language | Chinese (Traditional) |
| Patent number | I221026 |
| IPC | H01L-023/49 |
| Priority date | 22-12-05 |
| Filing date | 02-12-06 |
| Publication status | Published - 2004 Sept 11 |
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