產業創新群聚浮現與科技社群互動對創新活動影響之探討–以新竹科學園區及周邊為例

Translated title of the contribution: 產業創新群聚浮現與科技社群互動對創新活動影響之探討–以新竹科學園區及周邊為例

Tai-Shan Hu, 林建元, 錢學陶

Research output: Contribution to journal › Article › peer-review

Translated title of the contribution	產業創新群聚浮現與科技社群互動對創新活動影響之探討–以新竹科學園區及周邊為例
Original language	Chinese
Pages (from-to)	43-60
Journal	建築與規劃學報
Volume	6
Issue number	1
Publication status	Published - 2005

All Science Journal Classification (ASJC) codes

@article{a1eceaf935c64905a45283bee759be34,

title = "產業創新群聚浮現與科技社群互動對創新活動影響之探討–以新竹科學園區及周邊為例",

author = "Tai-Shan Hu and 建元林 and 學陶錢",

year = "2005",

language = "???core.languages.zh_ZH???",

volume = "6",

pages = "43--60",

journal = "Journal of Architecture and Planning",

issn = "1606-8238",

publisher = "College of Architecture and Planning, Chung Hua University",

number = "1",

}