1-nm-thick graphene tri-layer as the ultimate copper diffusion barrier

Ba Son Nguyen, Jen Fin Lin, Dung Ching Perng

Research output: Contribution to journalArticlepeer-review

60 Citations (Scopus)


We demonstrate the thinnest ever reported Cu diffusion barrier, a 1-nm-thick graphene tri-layer. X-ray diffraction patterns and Raman spectra show that the graphene is thermally stable at up to 750 C against Cu diffusion. Transmission electron microscopy images show that there was no inter-diffusion in the Cu/graphene/Si structure. Raman analyses indicate that the graphene may have degraded into a nanocrystalline structure at 750 C. At 800 C, the perfect carbon structure was damaged, and thus the barrier failed. The results of this study suggest that graphene could be the ultimate Cu interconnect diffusion barrier.

Original languageEnglish
Article number082105
JournalApplied Physics Letters
Issue number8
Publication statusPublished - 2014 Feb 24

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)


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