3-D corner delamination analysis for fan-out chip scale package

Tz-Cheng Chiu, Huang Chun Lin, Stoke Chen, G. S. Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The problem of a corner delamination in a fan-out chip scale package under thermomechanical load is investigated. The fracture mechanics parameters, including the stress intensity factors and the strain energy release rate, for a quarter-circular corner delamination between silicon die and fan-out redistribution polyimide layer are obtained by using numerical finite element approach with 3-D virtual crack closure technique (VCCT). Results of the analysis indicated that contact between crack faces occurs under temperature cycling condition. The delamination driving forces are mode-II and - III dominant. In addition, the strain energy release rate is highest near the location where the delamination crack front intersects die-to-molding compound interface. Parametric study is also conducted to investigate the effects of material properties and geometrical dimensions on the delamination driving forces. The calculated fracture mechanics parameters may be combined with the experimental data on the resistance to interface fracture for predicting reliability of the package.

Original languageEnglish
Title of host publicationProceedings - 2008 International Symposium on Microelectronics, IMAPS 2008
Pages687-693
Number of pages7
Publication statusPublished - 2008 Dec 1
Event41st Annual International Symposium on Microelectronics, IMAPS 2008 - Providence, RI, United States
Duration: 2008 Nov 22008 Nov 6

Publication series

NameProceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Other

Other41st Annual International Symposium on Microelectronics, IMAPS 2008
CountryUnited States
CityProvidence, RI
Period08-11-0208-11-06

Fingerprint

Chip scale packages
Delamination
Fans
Energy release rate
Strain energy
Fracture mechanics
Cracks
Sheet molding compounds
Crack closure
Polyimides
Stress intensity factors
Materials properties
Silicon

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Chiu, T-C., Lin, H. C., Chen, S., & Shen, G. S. (2008). 3-D corner delamination analysis for fan-out chip scale package. In Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008 (pp. 687-693). (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).
Chiu, Tz-Cheng ; Lin, Huang Chun ; Chen, Stoke ; Shen, G. S. / 3-D corner delamination analysis for fan-out chip scale package. Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. 2008. pp. 687-693 (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).
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Chiu, T-C, Lin, HC, Chen, S & Shen, GS 2008, 3-D corner delamination analysis for fan-out chip scale package. in Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008, pp. 687-693, 41st Annual International Symposium on Microelectronics, IMAPS 2008, Providence, RI, United States, 08-11-02.

3-D corner delamination analysis for fan-out chip scale package. / Chiu, Tz-Cheng; Lin, Huang Chun; Chen, Stoke; Shen, G. S.

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. 2008. p. 687-693 (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chiu T-C, Lin HC, Chen S, Shen GS. 3-D corner delamination analysis for fan-out chip scale package. In Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. 2008. p. 687-693. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).