TY - GEN
T1 - 3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules
AU - Chiou, Chi Han
AU - Huang, Yu Yen
AU - Chiang, Meng Han
AU - Lee, Huei Huang
AU - Lee, Gwo Bin
PY - 2006
Y1 - 2006
N2 - This study reports a new three-dimensional (3-D) micromachined magnetic tweezers, fabricated using MEMS (micro-electro-mechanical systems) technology, for manipulating a single 2-nm diameter DNA molecule. The new apparatus uses magnetic forces to exert over 20-pN,with less heating compared to other methods, allowing the extension of the DNA molecule over its whole contour length to investigate its entropic and elastic regions. The important elastic modulus of DNA has been explored to be 453 pN at a low ionic strength. The force-extension curve for DNA molecules is found to be consistent with theoretical models. In addition to a single DNA stretching, this study also successfully demonstrated the stretching of two parallel DNA molecules, which was never reported previously in the literature.
AB - This study reports a new three-dimensional (3-D) micromachined magnetic tweezers, fabricated using MEMS (micro-electro-mechanical systems) technology, for manipulating a single 2-nm diameter DNA molecule. The new apparatus uses magnetic forces to exert over 20-pN,with less heating compared to other methods, allowing the extension of the DNA molecule over its whole contour length to investigate its entropic and elastic regions. The important elastic modulus of DNA has been explored to be 453 pN at a low ionic strength. The force-extension curve for DNA molecules is found to be consistent with theoretical models. In addition to a single DNA stretching, this study also successfully demonstrated the stretching of two parallel DNA molecules, which was never reported previously in the literature.
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M3 - Conference contribution
AN - SCOPUS:33750115815
SN - 0780394755
SN - 9780780394759
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 142
EP - 145
BT - 19th IEEE International Conference on Micro Electro Mechanical Systems
T2 - 19th IEEE International Conference on Micro Electro Mechanical Systems
Y2 - 22 January 2006 through 26 January 2006
ER -