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3D-IC BISR for stacked memories using cross-die spares
Chun Chuan Chi, Yung Fa Chou, Ding Ming Kwai, Yu Ying Hsiao, Cheng Wen Wu, Yu Tsao Hsing, Li Ming Denq, Tsung Hsiang Lin
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
11
Citations
(Scopus)