3D-IC interconnect test, diagnosis, and repair

Chun Chuan Chi, Cheng Wen Wu, Min Jer Wang, Hung Chih Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

39 Citations (Scopus)

Fingerprint

Dive into the research topics of '3D-IC interconnect test, diagnosis, and repair'. Together they form a unique fingerprint.

Engineering & Materials Science