3D-IC test architecture for TSVs with different impact ranges of crosstalk faults

Wen Hsuan Hsu, Michael A. Kochte, Kuen Jong Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Through Silicon Vias (TSV) play an important role in 3D chip integration. Its features include: providing vertical interconnection, decreasing the area of routing, and increasing the bandwidth. Effective and efficient testing for correct operation of TSVs is an essential issue for 3D ICs. This work focuses on crosstalk faults with different impact ranges and proposes a TSV grouping method to test as many TSVs simultaneously as possible. Based on the results of the TSV grouping, we also implement a high-efficiency, low-area-overhead TSV test architecture.

Original languageEnglish
Title of host publication2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467394987
DOIs
Publication statusPublished - 2016 May 31
Event2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016 - Hsinchu, Taiwan
Duration: 2016 Apr 252016 Apr 27

Publication series

Name2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016

Other

Other2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016
CountryTaiwan
CityHsinchu
Period16-04-2516-04-27

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Instrumentation

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