3D integration opportunities, issues, and solutions: A designer's perspective

Ding Ming Kwai, Cheng Wen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

As the development cost of a typical system-on-chip (SOC) using state-of-the-art technology soars, more and more people turn to three-dimensional (3D) integration for possible alternatives that provide better or equal performance with lower cost. Stacking dies using the through-silicon-via (TSV) technology has been considered one of the most promising solutions to extending the life of Moore's law in semiconductor industry, but of course there are problems to be solved before the infrastructure can be set up to support the industry for manufacturing TSV-based 3D integrated devices. In this paper we will discuss the opportunities, design and manufacturing issues, and possible solutions for 3D integrated devices, from a designer's perspective.

Original languageEnglish
Title of host publicationLithography Asia 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 Lithography Asia Conference - Taipei, Taiwan
Duration: 2009 Nov 182009 Nov 19

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7520
ISSN (Print)0277-786X

Other

Other2009 Lithography Asia Conference
CountryTaiwan
CityTaipei
Period09-11-1809-11-19

Fingerprint

Silicon
manufacturing
Manufacturing
industries
Industry
systems-on-a-chip
Stacking
silicon
Costs
Semiconductors
Die
Infrastructure
Semiconductor materials
costs
Three-dimensional
Alternatives
Design
Life
System-on-chip
Three dimensional integrated circuits

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Kwai, D. M., & Wu, C. W. (2009). 3D integration opportunities, issues, and solutions: A designer's perspective. In Lithography Asia 2009 [752003] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7520). https://doi.org/10.1117/12.845747
Kwai, Ding Ming ; Wu, Cheng Wen. / 3D integration opportunities, issues, and solutions : A designer's perspective. Lithography Asia 2009. 2009. (Proceedings of SPIE - The International Society for Optical Engineering).
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Kwai, DM & Wu, CW 2009, 3D integration opportunities, issues, and solutions: A designer's perspective. in Lithography Asia 2009., 752003, Proceedings of SPIE - The International Society for Optical Engineering, vol. 7520, 2009 Lithography Asia Conference, Taipei, Taiwan, 09-11-18. https://doi.org/10.1117/12.845747

3D integration opportunities, issues, and solutions : A designer's perspective. / Kwai, Ding Ming; Wu, Cheng Wen.

Lithography Asia 2009. 2009. 752003 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7520).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kwai DM, Wu CW. 3D integration opportunities, issues, and solutions: A designer's perspective. In Lithography Asia 2009. 2009. 752003. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.845747