3D integration opportunities, issues, and solutions: A designer's perspective

Ding Ming Kwai, Cheng Wen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)


As the development cost of a typical system-on-chip (SOC) using state-of-the-art technology soars, more and more people turn to three-dimensional (3D) integration for possible alternatives that provide better or equal performance with lower cost. Stacking dies using the through-silicon-via (TSV) technology has been considered one of the most promising solutions to extending the life of Moore's law in semiconductor industry, but of course there are problems to be solved before the infrastructure can be set up to support the industry for manufacturing TSV-based 3D integrated devices. In this paper we will discuss the opportunities, design and manufacturing issues, and possible solutions for 3D integrated devices, from a designer's perspective.

Original languageEnglish
Title of host publicationLithography Asia 2009
Publication statusPublished - 2009 Dec 1
Event2009 Lithography Asia Conference - Taipei, Taiwan
Duration: 2009 Nov 182009 Nov 19

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


Other2009 Lithography Asia Conference

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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