3D printed high-entropy plasmonic structures for cutting-edge 6G modulation components on silicon wafers via electromagnetically induced reflection
- Wei Hsiang Chen
- , Yu Sheng Chen
- , Pei Jung Wu
- , Chien Hua Chen
- , Chuan Feng Shih
- , Chan Shan Yang
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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