3D printing of low melting temperature alloys by fused deposition modeling

P. C. Hsieh, C. H. Tsai, B. H. Liu, W. C.J. Wei, A. B. Wang, R. C. Luo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)


Fused deposition modeling (FDM) is the most commonly used 3D printing technique that directly extrudes molten materials layer by layer and overcomes the constraints of fabricating complicate geometries. This technique is fast, relatively easy to perform, thus more economical compared to other 3D printing methods. However, the materials that can be extruded by FDM are limited to polymers at the present time. This study aimed to develop a fused deposition modeling for metals (FDMm) system that can deposit metallic structures directly on a platform. An extruding nozzle designed by the researchers was connected to a commercial fused deposition machine to extend the materials selection from polymers to low melting temperature metals. Continuous Sn99.3Cu0.7 lead free solder and Sn60Pb40 lead free solder were successfully extruded in a linear shape and showed that the fabrication parameters for metals are significantly different from those for polymers. Controlling the fabrication parameters also allowed the deposition of metal at a uniform geometry. Optical microscopy and scanning electron microscopy were used to analyze the FDMm-fabricated samples. Good layer to layer bonding and overall material strength can be achieved by fine-tuning of process parameters.

Original languageEnglish
Title of host publicationProceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages5
ISBN (Electronic)9781467380751
Publication statusPublished - 2016 May 19
EventIEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan
Duration: 2016 Mar 142016 Mar 17

Publication series

NameProceedings of the IEEE International Conference on Industrial Technology


OtherIEEE International Conference on Industrial Technology, ICIT 2016

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering


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