TY - GEN
T1 - 6-T SRAM performance assessment with stacked silicon nanowire MOSFETs
AU - Huang, Ya Chi
AU - Chiang, Meng Hsueh
AU - Hsu, Wei Chou
AU - Cheng, Shiou Ying
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/4/13
Y1 - 2015/4/13
N2 - This paper assesses the 6-T SRAM performance and provides the design methodology with stacked gate-all-around silicon nanowire (NW) MOSFETs. To achieve high density design while preserving performance, different numbers of stacked NW MOSFETs are investigated via three-dimensional TCAD simulation. Due to tradeoff between read stability and writeability margins, adjusting the relative strengths of the transistors is needed but it can not be done straightforwardly as the widths of transistors are now quantized. Furthermore, when 3D stacking nanowires technique is used, another design issue with various stacked transistors has to be taken into account. This work simulates butterfly curves and N-curves to assess the device performance and provides an optimal design methodology for feasible manufacturability and good performance while using high density stacking technique. It is suggested that for the same stacked layers, though high stacking number favors writeability, it is limited to three layers due to source/drain series resistances. The double stacking is feasible for balanced read and write performances.
AB - This paper assesses the 6-T SRAM performance and provides the design methodology with stacked gate-all-around silicon nanowire (NW) MOSFETs. To achieve high density design while preserving performance, different numbers of stacked NW MOSFETs are investigated via three-dimensional TCAD simulation. Due to tradeoff between read stability and writeability margins, adjusting the relative strengths of the transistors is needed but it can not be done straightforwardly as the widths of transistors are now quantized. Furthermore, when 3D stacking nanowires technique is used, another design issue with various stacked transistors has to be taken into account. This work simulates butterfly curves and N-curves to assess the device performance and provides an optimal design methodology for feasible manufacturability and good performance while using high density stacking technique. It is suggested that for the same stacked layers, though high stacking number favors writeability, it is limited to three layers due to source/drain series resistances. The double stacking is feasible for balanced read and write performances.
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U2 - 10.1109/ISQED.2015.7085497
DO - 10.1109/ISQED.2015.7085497
M3 - Conference contribution
AN - SCOPUS:84944327782
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 610
EP - 614
BT - Proceedings of the 16th International Symposium on Quality Electronic Design, ISQED 2015
PB - IEEE Computer Society
T2 - 16th International Symposium on Quality Electronic Design, ISQED 2015
Y2 - 2 March 2015 through 4 March 2015
ER -