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2016
9 Citations (Scopus)
solders
Soldering alloys
mechanical properties
Mechanical properties
microstructure
2017
9 Citations (Scopus)

The mechanism of an increase in electrical resistance in Al thin film induced by current stressing

Liang, C. L., Lee, S. W. & Lin, K. L., 2017 Aug 31, In : Thin Solid Films. 636, p. 164-170 7 p.

Research output: Contribution to journalArticle

Acoustic impedance
electrical resistance
Electric currents
Thin films
thin films
2 Citations (Scopus)

Formation of nanojoints between carbon nanotubes and copper nanoparticles

Mittal, J. & Lin, K. L., 2017 Jan, In : Carbon Letters. 21, 1, p. 86-92 7 p.

Research output: Contribution to journalComment/debate

3 Citations (Scopus)
Growth kinetics
solders
Metallizing
Surface chemistry
Reaction kinetics
2 Citations (Scopus)

Current induced rapid phase transformation in Au/Sn reaction couple

Chiu, T. C. & Lin, K. L., 2017 Jan 1, In : Journal of Alloys and Compounds. 712, p. 111-120 10 p.

Research output: Contribution to journalArticle

Induced currents
Phase transitions
Transmission electron microscopy
X ray spectrometers
Crystals
4 Citations (Scopus)

Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

Mittal, J. & Lin, K. L., 2017 Jan 1, In : Journal of Electronic Materials. 46, 1, p. 602-608 7 p.

Research output: Contribution to journalArticle

Fluxes
Nanoparticles
nanoparticles
interactions
soldering
2018
3 Citations (Scopus)
Electromigration
electromigration
Intermetallics
intermetallics
Cathodes
5 Citations (Scopus)

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Chang, C. W. & Lin, K. L., 2018 Jul 1, In : Journal of Materials Science: Materials in Electronics. 29, 13, p. 10962-10968 7 p.

Research output: Contribution to journalArticle

solders
Toughness
toughness
mechanical properties
Mechanical properties
2019
3 Citations (Scopus)

High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Chang, C. W. & Lin, K-L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 135-141 7 p.

Research output: Contribution to journalArticle

solders
mechanical properties
Soldering alloys
Mechanical properties
elongation
2018
1 Citation (Scopus)

Crystal Structure Variations of Sn Nanoparticles upon Heating

Mittal, J. & Lin, K. L., 2018 Apr 1, In : Journal of Electronic Materials. 47, 4, p. 2394-2401 8 p.

Research output: Contribution to journalArticle

Crystal structure
Nanoparticles
Heating
nanoparticles
crystal structure
2019
1 Citation (Scopus)
Electromigration
Supersaturation
Cathodes
Temperature
Electrodes
2017
12 Citations (Scopus)

Non-deformation recrystallization of metal with electric current stressing

Liang, P. C. & Lin, K-L., 2017 Jan 1, In : Journal of Alloys and Compounds. 722, p. 690-697 8 p.

Research output: Contribution to journalArticle

Brass
Electric currents
Microhardness
Metals
Refining
8 Citations (Scopus)
solders
wettability
Surface chemistry
Soldering alloys
Wetting
2 Citations (Scopus)

Effect of doping element on the interfacial reaction behavior of Ag alloy wires bonding on Al pad after HTST and TCT tests

Lin, Y. W., Su, M. C., Huang, W. H., Chiu, Y. T., Shih, T. P. & Lin, K. L., 2017 Feb 21, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 613-619 7 p. 7861553. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Surface chemistry
Chemical elements
Doping (additives)
Wire
Ions
2016
7 Citations (Scopus)

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion
2019
solders
mechanical properties
Soldering alloys
Mechanical properties
Microhardness
2017
2 Citations (Scopus)

Carbon nanotube-based interconnections

Mittal, J. & Lin, K. L., 2017 Jan 1, In : Journal of Materials Science. 52, 2, p. 643-662 20 p.

Research output: Contribution to journalReview article

Carbon Nanotubes
Carbon nanotubes
2016
8 Citations (Scopus)
Intermetallics
intermetallics
voids
Electric currents
Substrates
2017
1 Citation (Scopus)
Solid state reactions
Soldering alloys
Intermetallics
Dissolution
Liquids
4 Citations (Scopus)
Multiwalled carbon nanotubes (MWCN)
Nanotubes
Thermal conductivity
nanotubes
thermal conductivity
2018
14 Citations (Scopus)

The microstructure and property variations of metals induced by electric current treatment: A review

Liang, C. L. & Lin, K. L., 2018 Nov, In : Materials Characterization. 145, p. 545-555 11 p.

Research output: Contribution to journalReview article

Electric currents
electric current
Metals
microstructure
Microstructure
2019
1 Citation (Scopus)
Electromigration
electromigration
Intermetallics
intermetallics
Solid solutions
2018
2 Citations (Scopus)

Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Lin, C. Y., Chiu, T. C. & Lin, K. L., 2018 Mar 21, In : Journal of Applied Physics. 123, 11, 115102.

Research output: Contribution to journalArticle

solders
intermetallics
dissolving
electric current
ambient temperature
2017
2 Citations (Scopus)

Fundamentals of solder alloys in 3D packaging

Lin, K. L., 2017 Jan 1, Springer Series in Advanced Microelectronics. Springer Verlag, p. 205-222 18 p. (Springer Series in Advanced Microelectronics; vol. 57).

Research output: Chapter in Book/Report/Conference proceedingChapter

Soldering alloys
Packaging
Intermetallics
Networks (circuits)
Substrates
2016
7 Citations (Scopus)

Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Huang, W. C. & Lin, K. L., 2016 Dec 1, In : Journal of Electronic Materials. 45, 12, p. 6137-6142 6 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
wetting
Wetting
Liquids
2017

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Wetting
Electron probe microanalysis
Substrates
2016
4 Citations (Scopus)

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Huang, W. H., Lin, K. L., Lin, Y. W. & Cheng, Y. K., 2016 Dec 1, In : Journal of Electronic Materials. 45, 12, p. 6130-6136 7 p.

Research output: Contribution to journalArticle

Intermetallics
intermetallics
wire
Wire
Palladium alloys
9 Citations (Scopus)

Disruption of crystalline structure of Sn3.5Ag induced by electric current

Huang, H. C., Lin, K-L. & Wu, A. T., 2016 Mar 21, In : Journal of Applied Physics. 119, 11, 115102.

Research output: Contribution to journalArticle

electric current
diffraction
solders
matrices
coalescing
2020

Electro-work hardening of metals induced by the athermal electromigration effect

Shu, C. C., Liang, C. L. & Lin, K. L., 2020 Jan 20, In : Materials Science and Engineering A. 772, 138689.

Research output: Contribution to journalArticle

work hardening
Electromigration
electromigration
Strain hardening
Metals
2018
1 Citation (Scopus)
solders
Metallizing
Soldering alloys
Intermetallics
intermetallics
2017
11 Citations (Scopus)

Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chen, C. W., Chiu, T. C., Chiu, Y. T., Lee, C. W. & Lin, K. L., 2017 Jun 1, In : Intermetallics. 85, p. 117-124 8 p.

Research output: Contribution to journalArticle

Induced currents
Intermetallics
Soldering alloys
Electromigration
Palladium
2018
1 Citation (Scopus)
solders
Soldering alloys
Aging of materials
intermetallics
Liquids
2019
3 Citations (Scopus)

Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys

Sarwono, D. & Lin, K. L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 99-106 8 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
wetting
Intermetallics
intermetallics
2 Citations (Scopus)
solders
Alloying
alloying
mechanical properties
Mechanical properties
2018
2 Citations (Scopus)

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Failure modes
Alloying
Nanohardness
2019
1 Citation (Scopus)

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

Chang, C. W. & Lin, K-L., 2019 Jul 30, In : Journal of Materials Science: Materials in Electronics. 30, 14, p. 13090-13098 9 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
Intermetallics
intermetallics
shear