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3D CoMoSe4 Nanosheet Arrays Converted Directly from Hydrothermally Processed CoMoO4 Nanosheet Arrays by Plasma-Assisted Selenization Process Toward Excellent Anode Material in Sodium-Ion Battery
Zhang, S., Ai, Y., Wu, S. C., Liao, H. J., Su, T. Y., Chen, J. H., Wang, C. H., Lee, L., Chen, Y. Z., Xu, B., Tang, S. Y., Wu, D. C., Lee, S. S., Yin, J., Li, J., Kang, J. & Chueh, Y. L., 2019, In: Nanoscale Research Letters. 14, 213.Research output: Contribution to journal › Article › peer-review
Open Access9 Citations (Scopus) -
3D computation of gray level co-occurrence in hyperspectral image cubes
Tsai, F., Chang, C. K., Rau, J-Y., Lin, T. H. & Liu, G. R., 2007, Energy Minimization Methods in Computer Vision and Pattern Recognition - 6th International Conference, EMMCVPR, 2007 Proceedings. Vol. 4679 LNCS. p. 429-440 12 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 4679 LNCS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
41 Citations (Scopus) -
3-D corner delamination analysis for fan-out chip scale package
Chiu, T-C., Lin, H. C., Chen, S. & Shen, G. S., 2008 Dec 1, Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. p. 687-693 7 p. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3-D dielectrophoresis chip and the manufacturing method thereof
Chang, H-C., 1800, Patent No. I274159Research output: Patent
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3D digital simulation of minnan temple architecture Caisson's craft techniques
Lin, Y. C., Wu, T. C. & Hsu, M., 2013, In: International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences - ISPRS Archives. 40, 5W2, p. 403-408 6 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
3D Digital Simulation of Minnan Temple Architecture Caisson’s Craft Techniques
Hsu, M., Wu, T. C. & Lin, Y-C., 2013 Sep, 24nd CIPA Symposium. Strasbourg, FranceResearch output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D Dirac Plasmons in the Type-II Dirac Semimetal PtTe2
Politano, A., Chiarello, G., Ghosh, B., Sadhukhan, K., Kuo, C. N., Lue, C. S., Pellegrini, V. & Agarwal, A., 2018 Aug 22, In: Physical review letters. 121, 8, 086804.Research output: Contribution to journal › Article › peer-review
65 Citations (Scopus) -
3D dynamic thermal and thermomechanical stress analysis of a hot blast stove
Gan, Y. F., Jang, J. Y. & Wu, T. Y., 2020 Oct, In: Ironmaking and Steelmaking. 47, 9, p. 959-972 14 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
3-D EHD enhanced natural convection over a horizontal plate flow with optimal design of a needle electrode system
Jang, J. Y. & Chen, C. C., 2018, In: Energies. 11, 7, 1670.Research output: Contribution to journal › Article › peer-review
Open Access5 Citations (Scopus) -
3D Elastostatic Boundary Element Analysis of thin bodies by Integral Regularizations
Shiah, Y. C., 2015 Oct 1, In: Journal of Mechanics. 31, 5, p. 533-543 11 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
3D face point cloud reconstruction and recognition using depth sensor
Wang, C. W. & Peng, C. C., 2021 Apr 2, In: Sensors. 21, 8, 2587.Research output: Contribution to journal › Article › peer-review
Open Access4 Citations (Scopus) -
3D facial surface reconstruction using integrated orthographic models to approximate perspective projection model
Wu, J. Y. & Lien, J. J. J., 2012 Jan 1, In: International Journal of Innovative Computing, Information and Control. 8, 1 B, p. 807-825 19 p.Research output: Contribution to journal › Article › peer-review
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3-D FDTD design analysis of a 2.4-GHz polarization-diversity printed dipole antenna with integrated balun and polarization-switching circuit for WLAN and wireless communication applications
Chuang, H. R. & Kuo, L. C., 2003 Feb, In: IEEE Transactions on Microwave Theory and Techniques. 51, 2 I, p. 374-381 8 p.Research output: Contribution to journal › Article › peer-review
136 Citations (Scopus) -
3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)
Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001 Sep, In: IEEE Microwave and Wireless Components Letters. 11, 9, p. 382-384 3 p.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)
Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronics Engineers Inc., p. 1271-1274 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 3).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D FEM simulation and experimental measurements of microwave microstrip dielectric‐resonator filters
Chuang, H-R., Huang, J. W., Wei, C. C. & Chang, J. L. C., 1995 Jan 1, In: Microwave and Optical Technology Letters. 8, 4, p. 196-200 5 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
3D Finite Element Complex Domain Numerical Models of Electric Fields in Blood and Myocardium
Wei, C. L., Valvano, J. W., Feldman, M. D., Nahrendorf, M. & Pearce, J. A., 2003, In: Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings. 1, p. 62-65 4 p.Research output: Contribution to journal › Conference article › peer-review
7 Citations (Scopus) -
3-D Finite element simulation for flat-die thread rolling of stainless steel
Chen, C. H., Wang, S. T. & Lee, R-S., 2005 Dec 1, In: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 26, 4, p. 617-622 6 p.Research output: Contribution to journal › Article › peer-review
12 Citations (Scopus) -
3D foot model construction from photos, model segmentation, and model alignment
Chu, W. T. & Lin, C. H., 2019 Oct, 2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019. Institute of Electrical and Electronics Engineers Inc., p. 349-353 5 p. 9015322. (2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
3-D force-balanced magnetospheric configurations
Zaharia, S., Cheng, C. Z. & Maezawa, K., 2004, In: Annales Geophysicae. 22, 1, p. 251-265 15 p.Research output: Contribution to journal › Article › peer-review
Open Access47 Citations (Scopus) -
3D Fractal reconstruction of terrain profile data based on digital elevation model
Huang, Y. M. & Chen, C. J., 2009 May 30, In: Chaos, solitons and fractals. 40, 4, p. 1741-1749 9 p.Research output: Contribution to journal › Article › peer-review
16 Citations (Scopus) -
3D geometry of the Chelungpu thrust system in central Taiwan: Its implications for active tectonics
Yang, K. M., Huang, S. T., Wu, J. C., Ting, H. H., Mei, W. W., Lee, M., Hsu, H. H. & Lee, C. J., 2007 Jun, In: Terrestrial, Atmospheric and Oceanic Sciences. 18, 2, p. 143-181 39 p.Research output: Contribution to journal › Article › peer-review
24 Citations (Scopus) -
3D-IC BISR for stacked memories using cross-die spares
Chi, C. C., Chou, Y. F., Kwai, D. M., Hsiao, Y. Y., Wu, C. W., Hsing, Y. T., Denq, L. M. & Lin, T. H., 2012 Jul 25, 2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers. 6212621. (2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
11 Citations (Scopus) -
3D-IC interconnect test, diagnosis, and repair
Chi, C. C., Wu, C. W., Wang, M. J. & Lin, H. C., 2013 Aug 14, Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013. 6548905. (Proceedings of the IEEE VLSI Test Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
39 Citations (Scopus) -
3D-IC test architecture for TSVs with different impact ranges of crosstalk faults
Hsu, W. H., Kochte, M. A. & Lee, K. J., 2016 May 31, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482554. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
3D image display of fetal ultrasonic image by thin shell
Wang, S. R., Sun, Y. N., Chang, F. M. & Jiang, C. F., 1999 Jan 1, In: Proceedings of SPIE - The International Society for Optical Engineering. 3661, II, p. 1478-1488 11 p.Research output: Contribution to journal › Conference article › peer-review
3 Citations (Scopus) -
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3D image reconstruction of bladder by nonlinear interpolation
Chin-Hsing, C., Ann-Shu, L., Jiann-Der, L. & Yang, W. H., 1995 Oct, In: Mathematical and Computer Modelling. 22, 8, p. 61-72 12 p.Research output: Contribution to journal › Article › peer-review
10 Citations (Scopus) -
3-D image reconstruction of brain blood vessels from angiograms
Guo, J. K., Chen, C. H., Lee, J. D. & Tsai, J. M., 1998 Apr, In: Computers and Mathematics with Applications. 35, 8, p. 79-94 16 p.Research output: Contribution to journal › Article › peer-review
7 Citations (Scopus) -
3-D Image reconstruction of brain vessels from angiograms
Lee, J. Y., Chen, C. H., Tasai, J. M., Sun, Y-N. & Mao, C. W., 1996 Dec 1, p. 547-552. 6 p.Research output: Contribution to conference › Paper › peer-review
4 Citations (Scopus) -
3-Dimensional representation for PC12 cell growth characterization
Lu, Y. Y., Huang, Y. J. & Cheng, K-S., 2012 Dec 1, 2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012. p. 688-691 4 p. 6513001. (2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D integration of vertical-stacking of MoS2and Si CMOS featuring embedded 2T1R configuration demonstrated on full wafers
Su, C. J., Huang, M. K., Lee, K. S., Hu, V. P. H., Huang, Y. F., Zheng, B. C., Yao, C. H., Lin, N. C., Kao, K. H., Hong, T. C., Sung, P. J., Wu, C. T., Yu, T. Y., Lin, K. L., Tseng, Y. C., Lin, C. L., Lee, Y. J., Chao, T. S., Li, J. Y., Wu, W. F. & 3 others, , 2020 Dec 12, 2020 IEEE International Electron Devices Meeting, IEDM 2020. Institute of Electrical and Electronics Engineers Inc., p. 12.2.1-12.2.4 9371988. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2020-December).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
3D integration opportunities, issues, and solutions: A designer's perspective
Kwai, D. M. & Wu, C. W., 2009 Dec 1, Lithography Asia 2009. 752003. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 7520).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
8 Citations (Scopus) -
3D laminated graphitic carbon nitride decorating with 2D/2D Bi2WO6/rGO nanosheets for selective photoreduction of CO2 to CO
Chen, I. T., Zheng, M. W., Pu, Y. C. & Liu, S. H., 2022, (Accepted/In press) In: International Journal of Energy Research.Research output: Contribution to journal › Article › peer-review
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3D localization of clustered microcalcifications using cranio-caudal and medio-lateral oblique views
Yang, S. C., Hsu, H. H., Hsu, G. C., Chung, P. C., Guo, S. M., Lo, C. S., Yang, C. W., Lee, S. K. & Chang, C. I., 2005 Oct, In: Computerized Medical Imaging and Graphics. 29, 7, p. 521-532 12 p.Research output: Contribution to journal › Article › peer-review
9 Citations (Scopus) -
3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules
Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H. H. & Lee, G. B., 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 142-145 4 p. 1627756. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2006).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
3D mapping of somatotopic reorganization with small animal functional MRI
Yu, X., Wang, S., Chen, D. Y., Dodd, S., Goloshevsky, A. & Koretsky, A. P., 2010 Jan 15, In: NeuroImage. 49, 2, p. 1667-1676 10 p.Research output: Contribution to journal › Article › peer-review
30 Citations (Scopus) -
3-D MICRO/NANO STRUCTURE AND MANUFACTURING METHOD THEREOF
Lee, Y-C., 1800, Patent No. I413177Research output: Patent
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3D microstructures array single-cell-based DEP chip for studying apoptosis of U937 & A431 cells
Chuang, C. H., Lee, Y. C., Huang, H. S., Hsiao, F. B., Hsu, Y. M., Wang, K. H., Ding, L. & Hsu, H. J., 2006, Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS. p. 1207-1210 4 p. 4135163. (Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
3D model retrieval and assessment for point cloud modeling
Hsu, P. C., Chen, J. Y. & Lin, C. H., 2010, 31st Asian Conference on Remote Sensing 2010, ACRS 2010. p. 1578-1583 6 p. (31st Asian Conference on Remote Sensing 2010, ACRS 2010; vol. 2).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D multi-track and multi-layer epitaxy grain growth simulations of selective laser melting
Dezfoli, A. R. A., Lo, Y. L. & Raza, M. M., 2021 Dec 1, In: Materials. 14, 23, 7346.Research output: Contribution to journal › Article › peer-review
Open Access4 Citations (Scopus) -
3D nano-scale cutting model for nickel material
Lin, Z. C., Huang, J. C. & Jeng, Y. R., 2007 Oct 1, In: Journal of Materials Processing Technology. 192-193, p. 27-36 10 p.Research output: Contribution to journal › Article › peer-review
38 Citations (Scopus) -
3-D numerical analysis for fluid flow and heat transfer in a micro chip by using an electrohydrodynamic micro-pump
Lin, C. W. & Jang, J. Y., 2005, Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005. American Society of Mechanical Engineers, p. 215-221 7 p. ICMM2005-75078. (Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005; vol. PART B).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3-D numerical and experimental analysis for airflow within a passenger compartment
Chien, C. H., Jang, J-Y., Chen, Y. H. & Wu, S. C., 2008 Aug 1, In: International Journal of Automotive Technology. 9, 4, p. 437-445 9 p.Research output: Contribution to journal › Article › peer-review
35 Citations (Scopus) -
3D numerical and experimental analysis for thermal-hydraulic characteristics of air flow inside a circular tube with different tube inserts
Chiu, Y. W. & Jang, J. Y., 2009 Feb, In: Applied Thermal Engineering. 29, 2-3, p. 250-258 9 p.Research output: Contribution to journal › Article › peer-review
67 Citations (Scopus) -
3-D numerical and experimental analysis of a built-in motorized high-speed spindle with helical water cooling channel
Chien, C. H. & Jang, J-Y., 2008 Dec 1, In: Applied Thermal Engineering. 28, 17-18, p. 2327-2336 10 p.Research output: Contribution to journal › Article › peer-review
58 Citations (Scopus) -
3D numerical definition with vectors for human smiles
Li, S. R., Chen, K. & Ma, M. Y., 2011 Sep 9, In: International Journal of Physical Sciences. 6, 18, p. 4419-4427 9 p.Research output: Contribution to journal › Article › peer-review
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3D Numerical heat transfer and fluid flow analysis in plate-fin and tube heat exchangers with electrohydrodynamic enhancement
Lin, C. W. & Jang, J. Y., 2005 May, In: Heat and Mass Transfer/Waerme- und Stoffuebertragung. 41, 7, p. 583-593 11 p.Research output: Contribution to journal › Article › peer-review
20 Citations (Scopus) -
3-D numerical heat transfer for confined turbulent twin circular jets impinging on an inclined moving plate
Jang, J-Y. & Huang, J. C., 2014 Jan 1.Research output: Contribution to conference › Paper › peer-review
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3D numerical micro-cooling analysis for an electrohydrodynamic micro-pump
Lin, C. W. & Jang, J. Y., 2005 Jul 29, In: Sensors and Actuators, A: Physical. 122, 1 SPEC. ISS., p. 167-176 10 p.Research output: Contribution to journal › Article › peer-review
25 Citations (Scopus)