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3D analysis of high-speed trains moving on bridges with foundation settlements
Ju, S-H., 2013 Feb 1, In: Archive of Applied Mechanics. 83, 2, p. 281-291 11 p.Research output: Contribution to journal › Article › peer-review
26 Citations (Scopus) -
3D and 4D bioprinting of the myocardium: Current approaches, challenges, and future prospects
Ong, C. S., Nam, L., Ong, K., Krishnan, A., Huang, C. Y., Fukunishi, T. & Hibino, N., 2018 Apr 22, In: BioMed research international. 2018, 6497242.Research output: Contribution to journal › Review article › peer-review
Open Access52 Citations (Scopus) -
3D apparel creation based on computer mannequin model. Part I: System kernel and formulas
Fang, J. J. & Liao, C. K., 2005 Oct 20, In: International Journal of Clothing Science and Technology. 17, 5, p. 292-306 15 p.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
3D apparel creation based on computer mannequin model. Part II: Implementations
Fang, J. J. & Liao, C. K., 2005 Oct 20, In: International Journal of Clothing Science and Technology. 17, 5, p. 307-319 13 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
3D bioprinting using stem cells
Ong, C. S., Yesantharao, P., Huang, C. Y., Mattson, G., Boktor, J., Fukunishi, T., Zhang, H. & Hibino, N., 2018 Jan 1, In: Pediatric Research. 83, 1-2, p. 223-231 9 p.Research output: Contribution to journal › Review article › peer-review
Open Access144 Citations (Scopus) -
3D blood vessel mapping of adult zebrafish using high frequency ultrasound ultrafast doppler imaging
Chang, C. C., Chen, P. Y. & Huang, C. C., 2017 Oct 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8092419. (IEEE International Ultrasonics Symposium, IUS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D blood vessel mapping of adult zebrafish using high frequency ultrasound ultrafast Doppler imaging
Chang, C. C., Chen, P. Y. & Huang, C. C., 2017 Oct 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091546. (IEEE International Ultrasonics Symposium, IUS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D B-spline curve fitting with MMS image features of road lines
Li, R. Y., Hsieh, C. Y. & Tseng, Y. H., 2009 Dec 1, 30th Asian Conference on Remote Sensing 2009, ACRS 2009. p. 1895-1900 6 p. (30th Asian Conference on Remote Sensing 2009, ACRS 2009; vol. 3).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
3D buckling analysis of FGM sandwich plates under bi-axial compressive loads
Wu, C. P. & Liu, W. L., 2014 Jan, In: Smart Structures and Systems. 13, 1, p. 111-135 25 p.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
3D building model retrieval for point cloud modeling
Hsu, P. C., Chen, J. Y. & Lin, C-H., 2011 Dec 1, 32nd Asian Conference on Remote Sensing 2011, ACRS 2011. p. 2243-2248 6 p. (32nd Asian Conference on Remote Sensing 2011, ACRS 2011; vol. 4).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
3D building model retrieval system based on LiDAR point cloud filling and encoding
Chen, J. Y., Hsu, P. C. & Lin, C. H., 2013, 34th Asian Conference on Remote Sensing 2013, ACRS 2013. Asian Association on Remote Sensing, p. 261-268 8 p. (34th Asian Conference on Remote Sensing 2013, ACRS 2013; vol. 1).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D cell capture and sensing array electrode (3D ECCSA) under extremely low frequency electromagnetic fields (ELF-EMF)
Liu, C. Y., Chen, C. H., Jang, L. S. & Wang, M. H., 2020 Oct 15, In: Sensors and Actuators, B: Chemical. 321, 128444.Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus) -
3-D cellular systems for air-land communications
Su, S-L. & Pan, W. C., 1994 Dec 1, p. 485-489. 5 p.Research output: Contribution to conference › Paper › peer-review
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3-D cerebral vessel reconstruction from angiograms
Chen, C. H., Yu, Y. C., Guo, J. K., Chen, C. H., Sun, Y. N. & Yu, C. I., 1993 Jan 1, Computer Analysis of Images and Patterns - 5th International Conference, CAIP 1993, Proceedings. Kropatsch, W. G. & Chetverikov, D. (eds.). Springer Verlag, p. 649-656 8 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 719 LNCS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D CFD simulation and parametric study of a flat plate deflector for vertical axis wind turbine
Wong, K. H., Chong, W. T., Poh, S. C., Shiah, Y. C., Sukiman, N. L. & Wang, C. T., 2018 Dec, In: Renewable Energy. 129, p. 32-55 24 p.Research output: Contribution to journal › Article › peer-review
48 Citations (Scopus) -
3d-cnn based computer-aided diagnosis (cadx) for lung nodule diagnosis
Tai, T. C., Tian, M., Cho, W. T. & Lai, C. F., 2020, Cognitive Cities - 2nd International Conference, IC3 2019, Revised Selected Papers. Shen, J., Chang, Y-C., Su, Y-S. & Ogata, H. (eds.). Springer, p. 35-43 9 p. (Communications in Computer and Information Science; vol. 1227 CCIS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D collar design creation
Fang, J. J., 2003 Apr 1, In: International Journal of Clothing Science and Technology. 15, 2, p. 88-106 19 p.Research output: Contribution to journal › Article › peer-review
7 Citations (Scopus) -
3D CoMoSe4 Nanosheet Arrays Converted Directly from Hydrothermally Processed CoMoO4 Nanosheet Arrays by Plasma-Assisted Selenization Process Toward Excellent Anode Material in Sodium-Ion Battery
Zhang, S., Ai, Y., Wu, S. C., Liao, H. J., Su, T. Y., Chen, J. H., Wang, C. H., Lee, L., Chen, Y. Z., Xu, B., Tang, S. Y., Wu, D. C., Lee, S. S., Yin, J., Li, J., Kang, J. & Chueh, Y. L., 2019, In: Nanoscale Research Letters. 14, 213.Research output: Contribution to journal › Article › peer-review
Open Access10 Citations (Scopus) -
3D computation of gray level co-occurrence in hyperspectral image cubes
Tsai, F., Chang, C. K., Rau, J-Y., Lin, T. H. & Liu, G. R., 2007, Energy Minimization Methods in Computer Vision and Pattern Recognition - 6th International Conference, EMMCVPR, 2007 Proceedings. Vol. 4679 LNCS. p. 429-440 12 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 4679 LNCS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
42 Citations (Scopus) -
3-D corner delamination analysis for fan-out chip scale package
Chiu, T-C., Lin, H. C., Chen, S. & Shen, G. S., 2008 Dec 1, Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. p. 687-693 7 p. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3-D dielectrophoresis chip and the manufacturing method thereof
Chang, H-C., 1800, Patent No. I274159Research output: Patent
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3D digital simulation of minnan temple architecture Caisson's craft techniques
Lin, Y. C., Wu, T. C. & Hsu, M., 2013, In: International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences - ISPRS Archives. 40, 5W2, p. 403-408 6 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
3D Digital Simulation of Minnan Temple Architecture Caisson’s Craft Techniques
Hsu, M., Wu, T. C. & Lin, Y-C., 2013 Sep, 24nd CIPA Symposium. Strasbourg, FranceResearch output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D Dirac Plasmons in the Type-II Dirac Semimetal PtTe2
Politano, A., Chiarello, G., Ghosh, B., Sadhukhan, K., Kuo, C. N., Lue, C. S., Pellegrini, V. & Agarwal, A., 2018 Aug 22, In: Physical review letters. 121, 8, 086804.Research output: Contribution to journal › Article › peer-review
74 Citations (Scopus) -
3D dynamic thermal and thermomechanical stress analysis of a hot blast stove
Gan, Y. F., Jang, J. Y. & Wu, T. Y., 2020 Oct, In: Ironmaking and Steelmaking. 47, 9, p. 959-972 14 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
3-D EHD enhanced natural convection over a horizontal plate flow with optimal design of a needle electrode system
Jang, J. Y. & Chen, C. C., 2018, In: Energies. 11, 7, 1670.Research output: Contribution to journal › Article › peer-review
Open Access5 Citations (Scopus) -
3D Elastostatic Boundary Element Analysis of thin bodies by Integral Regularizations
Shiah, Y. C., 2015 Oct 1, In: Journal of Mechanics. 31, 5, p. 533-543 11 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
3D face point cloud reconstruction and recognition using depth sensor
Wang, C. W. & Peng, C. C., 2021 Apr 2, In: Sensors. 21, 8, 2587.Research output: Contribution to journal › Article › peer-review
Open Access7 Citations (Scopus) -
3D facial surface reconstruction using integrated orthographic models to approximate perspective projection model
Wu, J. Y. & Lien, J. J. J., 2012 Jan 1, In: International Journal of Innovative Computing, Information and Control. 8, 1 B, p. 807-825 19 p.Research output: Contribution to journal › Article › peer-review
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3-D FDTD design analysis of a 2.4-GHz polarization-diversity printed dipole antenna with integrated balun and polarization-switching circuit for WLAN and wireless communication applications
Chuang, H. R. & Kuo, L. C., 2003 Feb, In: IEEE Transactions on Microwave Theory and Techniques. 51, 2 I, p. 374-381 8 p.Research output: Contribution to journal › Article › peer-review
136 Citations (Scopus) -
3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)
Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001 Sep, In: IEEE Microwave and Wireless Components Letters. 11, 9, p. 382-384 3 p.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)
Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronics Engineers Inc., p. 1271-1274 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 3).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D FEM simulation and experimental measurements of microwave microstrip dielectric‐resonator filters
Chuang, H-R., Huang, J. W., Wei, C. C. & Chang, J. L. C., 1995 Jan 1, In: Microwave and Optical Technology Letters. 8, 4, p. 196-200 5 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
3D Finite Element Complex Domain Numerical Models of Electric Fields in Blood and Myocardium
Wei, C. L., Valvano, J. W., Feldman, M. D., Nahrendorf, M. & Pearce, J. A., 2003, In: Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings. 1, p. 62-65 4 p.Research output: Contribution to journal › Conference article › peer-review
7 Citations (Scopus) -
3-D Finite element simulation for flat-die thread rolling of stainless steel
Chen, C. H., Wang, S. T. & Lee, R-S., 2005 Dec 1, In: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 26, 4, p. 617-622 6 p.Research output: Contribution to journal › Article › peer-review
14 Citations (Scopus) -
3D foot model construction from photos, model segmentation, and model alignment
Chu, W. T. & Lin, C. H., 2019 Oct, 2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019. Institute of Electrical and Electronics Engineers Inc., p. 349-353 5 p. 9015322. (2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
3-D force-balanced magnetospheric configurations
Zaharia, S., Cheng, C. Z. & Maezawa, K., 2004, In: Annales Geophysicae. 22, 1, p. 251-265 15 p.Research output: Contribution to journal › Article › peer-review
Open Access48 Citations (Scopus) -
3D Fractal reconstruction of terrain profile data based on digital elevation model
Huang, Y. M. & Chen, C. J., 2009 May 30, In: Chaos, solitons and fractals. 40, 4, p. 1741-1749 9 p.Research output: Contribution to journal › Article › peer-review
17 Citations (Scopus) -
3D geometry of the Chelungpu thrust system in central Taiwan: Its implications for active tectonics
Yang, K. M., Huang, S. T., Wu, J. C., Ting, H. H., Mei, W. W., Lee, M., Hsu, H. H. & Lee, C. J., 2007 Jun, In: Terrestrial, Atmospheric and Oceanic Sciences. 18, 2, p. 143-181 39 p.Research output: Contribution to journal › Article › peer-review
Open Access25 Citations (Scopus) -
3D hierarchical cobalt vanadate nanosheet arrays on Ni foam coupled with redox additive for enhanced supercapacitor performance
Nguyen, V. T., Sari, F. N. I. & Ting, J-M., 2022 Oct 12, In: RSC Advances. 12, 45, p. 29170-29176 7 p.Research output: Contribution to journal › Article › peer-review
Open Access -
3D-IC BISR for stacked memories using cross-die spares
Chi, C. C., Chou, Y. F., Kwai, D. M., Hsiao, Y. Y., Wu, C. W., Hsing, Y. T., Denq, L. M. & Lin, T. H., 2012 Jul 25, 2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers. 6212621. (2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
11 Citations (Scopus) -
3D-IC interconnect test, diagnosis, and repair
Chi, C. C., Wu, C. W., Wang, M. J. & Lin, H. C., 2013 Aug 14, Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013. 6548905. (Proceedings of the IEEE VLSI Test Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
41 Citations (Scopus) -
3D-IC test architecture for TSVs with different impact ranges of crosstalk faults
Hsu, W. H., Kochte, M. A. & Lee, K. J., 2016 May 31, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482554. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
3D image display of fetal ultrasonic image by thin shell
Wang, S. R., Sun, Y. N., Chang, F. M. & Jiang, C. F., 1999 Jan 1, In: Proceedings of SPIE - The International Society for Optical Engineering. 3661, II, p. 1478-1488 11 p.Research output: Contribution to journal › Conference article › peer-review
3 Citations (Scopus) -
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3D image reconstruction of bladder by nonlinear interpolation
Chin-Hsing, C., Ann-Shu, L., Jiann-Der, L. & Yang, W. H., 1995 Oct, In: Mathematical and Computer Modelling. 22, 8, p. 61-72 12 p.Research output: Contribution to journal › Article › peer-review
10 Citations (Scopus) -
3-D image reconstruction of brain blood vessels from angiograms
Guo, J. K., Chen, C. H., Lee, J. D. & Tsai, J. M., 1998 Apr, In: Computers and Mathematics with Applications. 35, 8, p. 79-94 16 p.Research output: Contribution to journal › Article › peer-review
7 Citations (Scopus) -
3-D Image reconstruction of brain vessels from angiograms
Lee, J. Y., Chen, C. H., Tasai, J. M., Sun, Y-N. & Mao, C. W., 1996 Dec 1, p. 547-552. 6 p.Research output: Contribution to conference › Paper › peer-review
4 Citations (Scopus) -
3-Dimensional representation for PC12 cell growth characterization
Lu, Y. Y., Huang, Y. J. & Cheng, K-S., 2012 Dec 1, 2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012. p. 688-691 4 p. 6513001. (2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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3D integration of vertical-stacking of MoS2and Si CMOS featuring embedded 2T1R configuration demonstrated on full wafers
Su, C. J., Huang, M. K., Lee, K. S., Hu, V. P. H., Huang, Y. F., Zheng, B. C., Yao, C. H., Lin, N. C., Kao, K. H., Hong, T. C., Sung, P. J., Wu, C. T., Yu, T. Y., Lin, K. L., Tseng, Y. C., Lin, C. L., Lee, Y. J., Chao, T. S., Li, J. Y., Wu, W. F., & 3 others , 2020 Dec 12, 2020 IEEE International Electron Devices Meeting, IEDM 2020. Institute of Electrical and Electronics Engineers Inc., p. 12.2.1-12.2.4 9371988. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2020-December).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus)