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• 3-D cellular systems for air-land communications

  Su, S-L. & Pan, W. C., 1994 Dec 1, p. 485-489. 5 p.

  Research output: Contribution to conference › Paper › peer-review

• 3-D cerebral vessel reconstruction from angiograms

  Chen, C. H., Yu, Y. C., Guo, J. K., Chen, C. H., Sun, Y. N. & Yu, C. I., 1993 Jan 1, Computer Analysis of Images and Patterns - 5th International Conference, CAIP 1993, Proceedings. Kropatsch, W. G. & Chetverikov, D. (eds.). Springer Verlag, p. 649-656 8 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 719 LNCS).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3D CFD simulation and parametric study of a flat plate deflector for vertical axis wind turbine

  Wong, K. H., Chong, W. T., Poh, S. C., Shiah, Y. C., Sukiman, N. L. & Wang, C. T., 2018 Dec, In: Renewable Energy. 129, p. 32-55 24 p.

  Research output: Contribution to journal › Article › peer-review
  48 Citations (Scopus)

• 3d-cnn based computer-aided diagnosis (cadx) for lung nodule diagnosis

  Tai, T. C., Tian, M., Cho, W. T. & Lai, C. F., 2020, Cognitive Cities - 2nd International Conference, IC3 2019, Revised Selected Papers. Shen, J., Chang, Y-C., Su, Y-S. & Ogata, H. (eds.). Springer, p. 35-43 9 p. (Communications in Computer and Information Science; vol. 1227 CCIS).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3D collar design creation

  Fang, J. J., 2003 Apr 1, In: International Journal of Clothing Science and Technology. 15, 2, p. 88-106 19 p.

  Research output: Contribution to journal › Article › peer-review
  7 Citations (Scopus)

• 3D CoMoSe₄ Nanosheet Arrays Converted Directly from Hydrothermally Processed CoMoO₄ Nanosheet Arrays by Plasma-Assisted Selenization Process Toward Excellent Anode Material in Sodium-Ion Battery

  Zhang, S., Ai, Y., Wu, S. C., Liao, H. J., Su, T. Y., Chen, J. H., Wang, C. H., Lee, L., Chen, Y. Z., Xu, B., Tang, S. Y., Wu, D. C., Lee, S. S., Yin, J., Li, J., Kang, J. & Chueh, Y. L., 2019, In: Nanoscale Research Letters. 14, 213.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  10 Citations (Scopus)

• 3D computation of gray level co-occurrence in hyperspectral image cubes

  Tsai, F., Chang, C. K., Rau, J-Y., Lin, T. H. & Liu, G. R., 2007, Energy Minimization Methods in Computer Vision and Pattern Recognition - 6th International Conference, EMMCVPR, 2007 Proceedings. Vol. 4679 LNCS. p. 429-440 12 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 4679 LNCS).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  42 Citations (Scopus)

• 3-D corner delamination analysis for fan-out chip scale package

  Chiu, T-C., Lin, H. C., Chen, S. & Shen, G. S., 2008 Dec 1, Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. p. 687-693 7 p. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3-D dielectrophoresis chip and the manufacturing method thereof

  Chang, H-C., 1800, Patent No. I274159

  Research output: Patent

• 3D digital simulation of minnan temple architecture Caisson's craft techniques

  Lin, Y. C., Wu, T. C. & Hsu, M., 2013, In: International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences - ISPRS Archives. 40, 5W2, p. 403-408 6 p.

  Research output: Contribution to journal › Article › peer-review
  1 Citation (Scopus)

• 3D Digital Simulation of Minnan Temple Architecture Caisson’s Craft Techniques

  Hsu, M., Wu, T. C. & Lin, Y-C., 2013 Sep, 24nd CIPA Symposium. Strasbourg, France

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3D Dirac Plasmons in the Type-II Dirac Semimetal PtTe2

  Politano, A., Chiarello, G., Ghosh, B., Sadhukhan, K., Kuo, C. N., Lue, C. S., Pellegrini, V. & Agarwal, A., 2018 Aug 22, In: Physical review letters. 121, 8, 086804.

  Research output: Contribution to journal › Article › peer-review
  71 Citations (Scopus)

• 3D dynamic thermal and thermomechanical stress analysis of a hot blast stove

  Gan, Y. F., Jang, J. Y. & Wu, T. Y., 2020 Oct, In: Ironmaking and Steelmaking. 47, 9, p. 959-972 14 p.

  Research output: Contribution to journal › Article › peer-review
  1 Citation (Scopus)

• 3-D EHD enhanced natural convection over a horizontal plate flow with optimal design of a needle electrode system

  Jang, J. Y. & Chen, C. C., 2018, In: Energies. 11, 7, 1670.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  5 Citations (Scopus)

• 3D Elastostatic Boundary Element Analysis of thin bodies by Integral Regularizations

  Shiah, Y. C., 2015 Oct 1, In: Journal of Mechanics. 31, 5, p. 533-543 11 p.

  Research output: Contribution to journal › Article › peer-review
  4 Citations (Scopus)

• 3D face point cloud reconstruction and recognition using depth sensor

  Wang, C. W. & Peng, C. C., 2021 Apr 2, In: Sensors. 21, 8, 2587.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  7 Citations (Scopus)

• 3D facial surface reconstruction using integrated orthographic models to approximate perspective projection model

  Wu, J. Y. & Lien, J. J. J., 2012 Jan 1, In: International Journal of Innovative Computing, Information and Control. 8, 1 B, p. 807-825 19 p.

  Research output: Contribution to journal › Article › peer-review

• 3-D FDTD design analysis of a 2.4-GHz polarization-diversity printed dipole antenna with integrated balun and polarization-switching circuit for WLAN and wireless communication applications

  Chuang, H. R. & Kuo, L. C., 2003 Feb, In: IEEE Transactions on Microwave Theory and Techniques. 51, 2 I, p. 374-381 8 p.

  Research output: Contribution to journal › Article › peer-review
  136 Citations (Scopus)

• 3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

  Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001 Sep, In: IEEE Microwave and Wireless Components Letters. 11, 9, p. 382-384 3 p.

  Research output: Contribution to journal › Article › peer-review
  5 Citations (Scopus)

• 3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

  Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronics Engineers Inc., p. 1271-1274 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 3).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3D FEM simulation and experimental measurements of microwave microstrip dielectric‐resonator filters

  Chuang, H-R., Huang, J. W., Wei, C. C. & Chang, J. L. C., 1995 Jan 1, In: Microwave and Optical Technology Letters. 8, 4, p. 196-200 5 p.

  Research output: Contribution to journal › Article › peer-review
  4 Citations (Scopus)

• 3D Finite Element Complex Domain Numerical Models of Electric Fields in Blood and Myocardium

  Wei, C. L., Valvano, J. W., Feldman, M. D., Nahrendorf, M. & Pearce, J. A., 2003, In: Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings. 1, p. 62-65 4 p.

  Research output: Contribution to journal › Conference article › peer-review
  7 Citations (Scopus)

• 3-D Finite element simulation for flat-die thread rolling of stainless steel

  Chen, C. H., Wang, S. T. & Lee, R-S., 2005 Dec 1, In: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 26, 4, p. 617-622 6 p.

  Research output: Contribution to journal › Article › peer-review
  13 Citations (Scopus)

• 3D foot model construction from photos, model segmentation, and model alignment

  Chu, W. T. & Lin, C. H., 2019 Oct, 2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019. Institute of Electrical and Electronics Engineers Inc., p. 349-353 5 p. 9015322. (2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  1 Citation (Scopus)

• 3-D force-balanced magnetospheric configurations

  Zaharia, S., Cheng, C. Z. & Maezawa, K., 2004, In: Annales Geophysicae. 22, 1, p. 251-265 15 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  48 Citations (Scopus)

• 3D Fractal reconstruction of terrain profile data based on digital elevation model

  Huang, Y. M. & Chen, C. J., 2009 May 30, In: Chaos, solitons and fractals. 40, 4, p. 1741-1749 9 p.

  Research output: Contribution to journal › Article › peer-review
  17 Citations (Scopus)

• 3D geometry of the Chelungpu thrust system in central Taiwan: Its implications for active tectonics

  Yang, K. M., Huang, S. T., Wu, J. C., Ting, H. H., Mei, W. W., Lee, M., Hsu, H. H. & Lee, C. J., 2007 Jun, In: Terrestrial, Atmospheric and Oceanic Sciences. 18, 2, p. 143-181 39 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  25 Citations (Scopus)

• 3D hierarchical cobalt vanadate nanosheet arrays on Ni foam coupled with redox additive for enhanced supercapacitor performance

  Nguyen, V. T., Sari, F. N. I. & Ting, J-M., 2022 Oct 12, In: RSC Advances. 12, 45, p. 29170-29176 7 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access

• 3D-IC BISR for stacked memories using cross-die spares

  Chi, C. C., Chou, Y. F., Kwai, D. M., Hsiao, Y. Y., Wu, C. W., Hsing, Y. T., Denq, L. M. & Lin, T. H., 2012 Jul 25, 2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers. 6212621. (2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  11 Citations (Scopus)

• 3D-IC interconnect test, diagnosis, and repair

  Chi, C. C., Wu, C. W., Wang, M. J. & Lin, H. C., 2013 Aug 14, Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013. 6548905. (Proceedings of the IEEE VLSI Test Symposium).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  41 Citations (Scopus)

• 3D-IC test architecture for TSVs with different impact ranges of crosstalk faults

  Hsu, W. H., Kochte, M. A. & Lee, K. J., 2016 May 31, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482554. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  3 Citations (Scopus)

• 3D image display of fetal ultrasonic image by thin shell

  Wang, S. R., Sun, Y. N., Chang, F. M. & Jiang, C. F., 1999 Jan 1, In: Proceedings of SPIE - The International Society for Optical Engineering. 3661, II, p. 1478-1488 11 p.

  Research output: Contribution to journal › Conference article › peer-review
  3 Citations (Scopus)

• 3-D image-forming apparatus

  Cheng, K-S., 1800, Patent No. I325096

  Research output: Patent

• 3D image reconstruction of bladder by nonlinear interpolation

  Chin-Hsing, C., Ann-Shu, L., Jiann-Der, L. & Yang, W. H., 1995 Oct, In: Mathematical and Computer Modelling. 22, 8, p. 61-72 12 p.

  Research output: Contribution to journal › Article › peer-review
  10 Citations (Scopus)

• 3-D image reconstruction of brain blood vessels from angiograms

  Guo, J. K., Chen, C. H., Lee, J. D. & Tsai, J. M., 1998 Apr, In: Computers and Mathematics with Applications. 35, 8, p. 79-94 16 p.

  Research output: Contribution to journal › Article › peer-review
  7 Citations (Scopus)

• 3-D Image reconstruction of brain vessels from angiograms

  Lee, J. Y., Chen, C. H., Tasai, J. M., Sun, Y-N. & Mao, C. W., 1996 Dec 1, p. 547-552. 6 p.

  Research output: Contribution to conference › Paper › peer-review
  4 Citations (Scopus)

• 3-Dimensional representation for PC12 cell growth characterization

  Lu, Y. Y., Huang, Y. J. & Cheng, K-S., 2012 Dec 1, 2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012. p. 688-691 4 p. 6513001. (2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3D integration of vertical-stacking of MoS₂and Si CMOS featuring embedded 2T1R configuration demonstrated on full wafers

  Su, C. J., Huang, M. K., Lee, K. S., Hu, V. P. H., Huang, Y. F., Zheng, B. C., Yao, C. H., Lin, N. C., Kao, K. H., Hong, T. C., Sung, P. J., Wu, C. T., Yu, T. Y., Lin, K. L., Tseng, Y. C., Lin, C. L., Lee, Y. J., Chao, T. S., Li, J. Y., Wu, W. F., & 3 othersShieh, J. M., Wang, Y. H. & Yeh, W. K., 2020 Dec 12, 2020 IEEE International Electron Devices Meeting, IEDM 2020. Institute of Electrical and Electronics Engineers Inc., p. 12.2.1-12.2.4 9371988. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2020-December).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  2 Citations (Scopus)

• 3D integration opportunities, issues, and solutions: A designer's perspective

  Kwai, D. M. & Wu, C. W., 2009 Dec 1, Lithography Asia 2009. 752003. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 7520).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  8 Citations (Scopus)

• 3D laminated graphitic carbon nitride decorating with 2D/2D Bi₂WO₆/rGO nanosheets for selective photoreduction of CO₂ to CO

  Chen, I. T., Zheng, M. W., Pu, Y. C. & Liu, S. H., 2022 Sep, In: International Journal of Energy Research. 46, 11, p. 15198-15210 13 p.

  Research output: Contribution to journal › Article › peer-review
  1 Citation (Scopus)

• 3D localization of clustered microcalcifications using cranio-caudal and medio-lateral oblique views

  Yang, S. C., Hsu, H. H., Hsu, G. C., Chung, P. C., Guo, S. M., Lo, C. S., Yang, C. W., Lee, S. K. & Chang, C. I., 2005 Oct, In: Computerized Medical Imaging and Graphics. 29, 7, p. 521-532 12 p.

  Research output: Contribution to journal › Article › peer-review
  9 Citations (Scopus)

• 3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules

  Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H. H. & Lee, G. B., 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 142-145 4 p. 1627756. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2006).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  1 Citation (Scopus)

• 3D mapping of somatotopic reorganization with small animal functional MRI

  Yu, X., Wang, S., Chen, D. Y., Dodd, S., Goloshevsky, A. & Koretsky, A. P., 2010 Jan 15, In: NeuroImage. 49, 2, p. 1667-1676 10 p.

  Research output: Contribution to journal › Article › peer-review
  30 Citations (Scopus)

• 3-D MICRO/NANO STRUCTURE AND MANUFACTURING METHOD THEREOF

  Lee, Y-C., 1800, Patent No. I413177

  Research output: Patent

• 3D microstructures array single-cell-based DEP chip for studying apoptosis of U937 & A431 cells

  Chuang, C. H., Lee, Y. C., Huang, H. S., Hsiao, F. B., Hsu, Y. M., Wang, K. H., Ding, L. & Hsu, H. J., 2006, Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS. p. 1207-1210 4 p. 4135163. (Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  2 Citations (Scopus)

• 3D model retrieval and assessment for point cloud modeling

  Hsu, P. C., Chen, J. Y. & Lin, C. H., 2010, 31st Asian Conference on Remote Sensing 2010, ACRS 2010. p. 1578-1583 6 p. (31st Asian Conference on Remote Sensing 2010, ACRS 2010; vol. 2).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3D multi-track and multi-layer epitaxy grain growth simulations of selective laser melting

  Dezfoli, A. R. A., Lo, Y. L. & Raza, M. M., 2021 Dec 1, In: Materials. 14, 23, 7346.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  5 Citations (Scopus)

• 3D nano-scale cutting model for nickel material

  Lin, Z. C., Huang, J. C. & Jeng, Y. R., 2007 Oct 1, In: Journal of Materials Processing Technology. 192-193, p. 27-36 10 p.

  Research output: Contribution to journal › Article › peer-review
  39 Citations (Scopus)

• 3-D numerical analysis for fluid flow and heat transfer in a micro chip by using an electrohydrodynamic micro-pump

  Lin, C. W. & Jang, J. Y., 2005, Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005. American Society of Mechanical Engineers, p. 215-221 7 p. ICMM2005-75078. (Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005; vol. PART B).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• 3-D numerical and experimental analysis for airflow within a passenger compartment

  Chien, C. H., Jang, J-Y., Chen, Y. H. & Wu, S. C., 2008 Aug 1, In: International Journal of Automotive Technology. 9, 4, p. 437-445 9 p.

  Research output: Contribution to journal › Article › peer-review
  35 Citations (Scopus)