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Publication Year

  • 2020
  • 2019
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Author

  • Truan-Sheng Lui
Article
3 Citations (Scopus)

A new infrared heat treatment on hot forging 7075 aluminum alloy: Microstructure and mechanical properties

Chang, Y. L., Hung, F. Y. & Lui, T. S., 2020 Mar 1, In : Materials. 13, 5, 1177.

Research output: Contribution to journalArticle

Open Access

A study on electromigration-inducing intergranular fracture of fine silver alloy wires

Hsueh, H. W., Hung, F. Y. & Lui, T. S., 2017 Jan 16, In : Applied Physics Letters. 110, 3, 031902.

Research output: Contribution to journalArticle

5 Citations (Scopus)

Cell response on the biomimetic scaffold of silicon nano- and micro-topography

Yang, S. P., Wen, H. S., Lee, T. M. & Lui, T. S., 2016 Mar 14, In : Journal of Materials Chemistry B. 4, 10, p. 1891-1897 7 p.

Research output: Contribution to journalArticle

8 Citations (Scopus)
4 Citations (Scopus)

Decrease in hydrogen embrittlement susceptibility of 10B21 screws by bake aging

Chen, K. J., Hung, F. Y., Lui, T. S. & Tseng, C. H., 2016 Sep, In : Metals. 6, 9, 211.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Development of a novel micro-textured surface using duplex surface modification for biomedical Mg alloy applications

Lin, D. J., Hung, F-Y., Yeh, M-L., Lee, H. P. & Lui, T-S., 2017 Nov 1, In : Materials Letters. 206, p. 9-12 4 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)

Effects of friction stir process and stabilization heat treatment on tensile characteristics and punch-shear properties of AZ61 alloy

Chen, H. C., Hung, F. Y., Lui, T. S. & Chen, L. H., 2017 Jan 1, In : Materials Transactions. 58, 1, p. 6-10 5 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Embrittlement due to excess heat input into friction stir processed 7075 alloy

Ku, M. H., Hung, F. Y. & Lui, T. S., 2019 Jan 10, In : Materials. 12, 2, 227.

Research output: Contribution to journalArticle

Enhanced formability and accelerated precipitation behavior of 7075 Al alloy extruded rod by high temperature aging

Ku, M. H., Hung, F. Y., Lui, T. S. & Lai, J. C., 2018 Aug 17, In : Metals. 8, 8, 648.

Research output: Contribution to journalArticle

4 Citations (Scopus)

Enhancement of mechanical properties of hot-forged 6082 suspension parts via rapid IR heat treatment

Chang, Y. L., Hung, F. Y. & Lui, T. S., 2018 Jul, In : Metals. 8, 7, 501.

Research output: Contribution to journalArticle

3 Citations (Scopus)
1 Citation (Scopus)

Enhancing the tensile yield strength of A6082 aluminum alloy with rapid heat solutionizing

Chang, Y. L., Hung, F. Y. & Lui, T. S., 2017 Aug 15, In : Materials Science and Engineering A. 702, p. 438-445 8 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)
Open Access
1 Citation (Scopus)
Open Access
1 Citation (Scopus)
4 Citations (Scopus)

High-temperature deformation resistance and forming behavior of two-step SIMA-processed 6066 alloy

Lin, C. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 Apr 6, In : Materials Science and Engineering A. 659, p. 143-157 15 p.

Research output: Contribution to journalArticle

10 Citations (Scopus)
Open Access
1 Citation (Scopus)

Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application

Chen, K. J., Hung, F. Y., Lui, T. S. & Hsu, L., 2019 Aug 1, In : Micromachines. 10, 8, 550.

Research output: Contribution to journalArticle

Open Access

Mechanical and Electrical Properties of Palladium-Coated Copper Wires with Flash Gold

Chang, C. Y., Hung, F-Y. & Lui, T-S., 2017 Jul 1, In : Journal of Electronic Materials. 46, 7, p. 4384-4391 8 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
1 Citation (Scopus)
Open Access
3 Citations (Scopus)
4 Citations (Scopus)
1 Citation (Scopus)

Microstructures and mechanical properties of austempering SUS440 steel thin plates

Chen, C. Y., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 Feb 15, In : Metals. 6, 2, 35.

Research output: Contribution to journalArticle

1 Citation (Scopus)
Open Access
1 Citation (Scopus)

Structural Characteristics and Particle Erosion Resistance of SIMA-Processed Al-Mg-Si Alloy

Lin, C. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 Jan 1, In : Materials Transactions. 57, 2, p. 135-142 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
2 Citations (Scopus)
1 Citation (Scopus)
2 Citations (Scopus)
2 Citations (Scopus)

Study on characteristics of interfacial microstructure and electrical current mechanism in Sn-xZn/Al photovoltaic modules

Lin, C. W., Hung, F. Y., Lui, T. S. & Huang, D. J., 2018 Aug, In : Solar Energy. 170, p. 840-848 9 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2 Citations (Scopus)
Open Access
3 Citations (Scopus)
1 Citation (Scopus)
Chapter

A study of microstructural stability of friction stir welded joints of Al-Mg alloys during subsequent thermal exposure

Lin, C. Y., Lui, T. S. & Chen, L. H., 2016 Jan 1, Light Metals 2012. Springer International Publishing, p. 527-532 6 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Effect of silicon particles on the tensile properties of heat resistant Al-Si-Cu-Ni-Mg alloy pertaining to different tensile temperature

Chuang, H. C., Lui, T. S. & Chen, L. H., 2016 Jan 1, Light Metals 2012. Springer International Publishing, p. 461-466 6 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Effect of tool rotational speed on the microstructures and tensile properties of 7075 aluminum alloy via Friction Stir Process (FSP)

Ku, M. H., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 Jan 1, Light Metals 2012. Springer International Publishing, p. 475-480 6 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Conference contribution

Electrical tensile test

Hsueh, H. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 Jan 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390694. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 Jan 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)