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  • Kwang-Lung Lin
2020

Electro-work hardening of metals induced by the athermal electromigration effect

Shu, C. C., Liang, C. L. & Lin, K. L., 2020 Jan 20, In : Materials Science and Engineering A. 772, 138689.

Research output: Contribution to journalArticle

2019
1 Citation (Scopus)

High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Chang, C. W. & Lin, K-L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 135-141 7 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
1 Citation (Scopus)
2 Citations (Scopus)

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

Chang, C. W. & Lin, K. L., 2019 Jul 30, In : Journal of Materials Science: Materials in Electronics. 30, 14, p. 13090-13098 9 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys

Sarwono, D. & Lin, K. L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 99-106 8 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
2018

Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Lin, C. Y., Chiu, T. C. & Lin, K. L., 2018 Mar 21, In : Journal of Applied Physics. 123, 11, 115102.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Crystal Structure Variations of Sn Nanoparticles upon Heating

Mittal, J. & Lin, K. L., 2018 Apr 1, In : Journal of Electronic Materials. 47, 4, p. 2394-2401 8 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2 Citations (Scopus)

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Chang, C. W. & Lin, K. L., 2018 Jul 1, In : Journal of Materials Science: Materials in Electronics. 29, 13, p. 10962-10968 7 p.

Research output: Contribution to journalArticle

5 Citations (Scopus)
3 Citations (Scopus)

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
1 Citation (Scopus)

The microstructure and property variations of metals induced by electric current treatment: A review

Liang, C. L. & Lin, K. L., 2018 Nov, In : Materials Characterization. 145, p. 545-555 11 p.

Research output: Contribution to journalReview article

15 Citations (Scopus)
2017

Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

Mittal, J. & Lin, K. L., 2017 Jan 1, In : Journal of Electronic Materials. 46, 1, p. 602-608 7 p.

Research output: Contribution to journalArticle

4 Citations (Scopus)
4 Citations (Scopus)

Carbon nanotube-based interconnections

Mittal, J. & Lin, K. L., 2017 Jan 1, In : Journal of Materials Science. 52, 2, p. 643-662 20 p.

Research output: Contribution to journalReview article

2 Citations (Scopus)

Current induced rapid phase transformation in Au/Sn reaction couple

Chiu, T. C. & Lin, K. L., 2017 Jan 1, In : Journal of Alloys and Compounds. 712, p. 111-120 10 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chen, C. W., Chiu, T. C., Chiu, Y. T., Lee, C. W. & Lin, K. L., 2017 Jun 1, In : Intermetallics. 85, p. 117-124 8 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)
3 Citations (Scopus)

Effect of doping element on the interfacial reaction behavior of Ag alloy wires bonding on Al pad after HTST and TCT tests

Lin, Y. W., Su, M. C., Huang, W. H., Chiu, Y. T., Shih, T. P. & Lin, K. L., 2017 Feb 21, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 613-619 7 p. 7861553. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
8 Citations (Scopus)

Formation of nanojoints between carbon nanotubes and copper nanoparticles

Mittal, J. & Lin, K. L., 2017 Jan, In : Carbon Letters. 21, 1, p. 86-92 7 p.

Research output: Contribution to journalComment/debate

2 Citations (Scopus)

Fundamentals of solder alloys in 3D packaging

Lin, K. L., 2017 Jan 1, Springer Series in Advanced Microelectronics. Springer Verlag, p. 205-222 18 p. (Springer Series in Advanced Microelectronics; vol. 57).

Research output: Chapter in Book/Report/Conference proceedingChapter

2 Citations (Scopus)

Non-deformation recrystallization of metal with electric current stressing

Liang, P. C. & Lin, K. L., 2017 Jan 1, In : Journal of Alloys and Compounds. 722, p. 690-697 8 p.

Research output: Contribution to journalArticle

13 Citations (Scopus)
1 Citation (Scopus)

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The mechanism of an increase in electrical resistance in Al thin film induced by current stressing

Liang, C. L., Lee, S. W. & Lin, K. L., 2017 Aug 31, In : Thin Solid Films. 636, p. 164-170 7 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)
2016

Disruption of crystalline structure of Sn3.5Ag induced by electric current

Huang, H. C., Lin, K-L. & Wu, A. T., 2016 Mar 21, In : Journal of Applied Physics. 119, 11, 115102.

Research output: Contribution to journalArticle

9 Citations (Scopus)

Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Huang, W. C. & Lin, K. L., 2016 Dec 1, In : Journal of Electronic Materials. 45, 12, p. 6137-6142 6 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)
8 Citations (Scopus)

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Huang, W. H., Lin, K. L., Lin, Y. W. & Cheng, Y. K., 2016 Dec 1, In : Journal of Electronic Materials. 45, 12, p. 6130-6136 7 p.

Research output: Contribution to journalArticle

5 Citations (Scopus)
9 Citations (Scopus)
2015

Electro-dissolution of the Bi second phase in Sn5Bi solder alloy

Chiu, T. C., Chiu, Y. T. & Lin, K. L., 2015 Dec 1, In : Materials Letters. 160, p. 309-313 5 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Exothermic low temperature sintering of Cu nanoparticles

Mittal, J. & Lin, K. L., 2015 Nov 1, In : Materials Characterization. 109, p. 19-24 6 p.

Research output: Contribution to journalArticle

12 Citations (Scopus)

High dislocation density of tin induced by electric current

Liao, Y. H., Liang, C. L., Lin, K. L. & Wu, A. T., 2015 Dec 1, In : AIP Advances. 5, 12, 127210.

Research output: Contribution to journalArticle

12 Citations (Scopus)
13 Citations (Scopus)

Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Liang, C. L., Lin, K. L. & Peng, J. W., 2015 Sep 30, (Accepted/In press) In : Journal of Electronic Materials.

Research output: Contribution to journalArticle

Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent

Frischa, M. W. & Lin, K. L., 2015 Oct 28, (Accepted/In press) In : Journal of Electronic Materials.

Research output: Contribution to journalArticle

The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

Pan, C. C., Lin, Y. W., Lin, C. I., Mittal, J. & Lin, K. L., 2015 Dec 15, In : Journal of Non-Crystalline Solids. 430, p. 38-42 5 p., 17594.

Research output: Contribution to journalArticle

The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing

He, J. Y., Lin, K. L. & Wu, A. T., 2015 Jan 15, In : Journal of Alloys and Compounds. 619, p. 372-377 6 p.

Research output: Contribution to journalArticle

14 Citations (Scopus)

The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing

Wang, T. H. & Lin, K. L., 2015 Nov 6, (Accepted/In press) In : Journal of Electronic Materials.

Research output: Contribution to journalArticle

2014

Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder

Liu, C. W. & Lin, K. L., 2014 Jan 1, In : Journal of Electronic Materials. 43, 12, p. 4502-4509 8 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)

Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Zou, Y. S., Hsiao, Y. H. & Lin, K-L., 2014 Jan 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 155-158 4 p. 7028311. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng, J. W., Chen, Y. S., Chen, Y., Liang, J. L., Lin, K. L. & Lee, Y. L., 2014 Sep 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1584-1589 6 p. 689750. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L. & Lin, K-L., 2014 Sep 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 419-424 6 p. 6897319. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)