@inproceedings{a96f2e9ee58a44f6a4a1ceeadcf39bcb,
title = "A 60-GHz CMOS RF sub-harmonic RF transceiver front-end with integrated artificial-magnetic-conductor (AMC) on-chip Yagi-antenna and balun filter",
abstract = "A 60-GHz CMOS sub-harmonic RF transceiver with an integrated on-chip artificial-magnetic-conductor (AMC) Yagi-antenna and a balun-bandpass-filter (BPF) fabricated in 90-nm technology is presented. With the AMC structure, the radiation efficiency and power gain of the on-chip antenna can be increased. The on-chip balun-BPF combines the integrated design of the balun and RF BPF to reduce the circuit size and the insertion loss. The transmitter/receiver (T/R) switch with the leakage cancellation technique is used to increase the isolation between the T/R ports. The class-A power amplifier is utilized to achieve high linearity and power gain. The sub-harmonic receiver is adopted to mitigate the DC offset problem. The probe-station based on-wafer continuous wave (CW) wireless transmission test is conducted (R = 1 m). The measured total transmitting gain Gant+Tx and receiving conversion gain CGant+Rx of the integrated RF transceiver (with the on-chip AMC antenna and the balun-BPF) are 5 dB and 10.1 dB at 60 GHz, respectively. In error vector magnitude (EVM) tests, the maximum data rates of the transceiver in 16QAM mode at a 50-cm wireless link have been investigated. The presented integrated RF transceiver will be very useful for the design of a 60 GHz fully integrated CMOS single-chip radio for very-short-range (VSR) communication applications.",
author = "Lin, {Chien Chih} and Kuo, {Hsin Chih} and Chou, {Chien Chang} and Chuang, {Huey Ru}",
note = "Publisher Copyright: {\textcopyright} 2014 European Microwave Association-EUMA.; 9th European Microwave Integrated Circuits Conference, EuMIC 2014 - Held as Part of the 17th European Microwave Week, EuMW 2014 ; Conference date: 06-10-2014 Through 07-10-2014",
year = "2014",
month = dec,
day = "23",
doi = "10.1109/EuMIC.2014.6997847",
language = "English",
series = "European Microwave Week 2014: {"}Connecting the Future{"}, EuMW 2014 - Conference Proceedings; EuMIC 2014: 9th European Microwave Integrated Circuits Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "281--284",
booktitle = "European Microwave Week 2014",
address = "United States",
}