Abstract
We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 |
| Pages | 792-796 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2007 |
| Event | 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand Duration: 2007 Jan 16 → 2007 Jan 19 |
Other
| Other | 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 |
|---|---|
| Country | Thailand |
| City | Bangkok |
| Period | 07-01-16 → 07-01-19 |
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All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Computer Science Applications
- Electrical and Electronic Engineering
Cite this
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A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. / Chen, Chun Hung; Lee, Yung Chun; Hsiao, Fei Bin.
Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 792-796 4160439.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating
AU - Chen, Chun Hung
AU - Lee, Yung Chun
AU - Hsiao, Fei Bin
PY - 2007
Y1 - 2007
N2 - We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.
AB - We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.
UR - http://www.scopus.com/inward/record.url?scp=34548143338&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34548143338&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2007.352136
DO - 10.1109/NEMS.2007.352136
M3 - Conference contribution
AN - SCOPUS:34548143338
SN - 1424406102
SN - 9781424406104
SP - 792
EP - 796
BT - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
ER -