A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating

Chun Hung Chen, Yung Chun Lee, Fei Bin Hsiao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

Original languageEnglish
Title of host publicationProceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Pages792-796
Number of pages5
DOIs
Publication statusPublished - 2007
Event2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand
Duration: 2007 Jan 162007 Jan 19

Other

Other2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
CountryThailand
CityBangkok
Period07-01-1607-01-19

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering

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