A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating

Chun Hung Chen; Yung Chun Lee; Fei Bin Hsiao

doi:10.1109/NEMS.2007.352136

A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating

Chun Hung Chen, Yung Chun Lee, Fei Bin Hsiao

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

Original language	English
Title of host publication	Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Pages	792-796
Number of pages	5
DOIs	https://doi.org/10.1109/NEMS.2007.352136
Publication status	Published - 2007
Event	2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand Duration: 2007 Jan 16 → 2007 Jan 19

Other

Other	2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Country	Thailand
City	Bangkok
Period	07-01-16 → 07-01-19

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Computer Science Applications
Electrical and Electronic Engineering

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title = "A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating",

abstract = "We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.",

author = "Chen, {Chun Hung} and Lee, {Yung Chun} and Hsiao, {Fei Bin}",

year = "2007",

doi = "10.1109/NEMS.2007.352136",

language = "English",

isbn = "1424406102",

pages = "792--796",

booktitle = "Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007",

note = "2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 ; Conference date: 16-01-2007 Through 19-01-2007",

}

Chen, CH, Lee, YC & Hsiao, FB 2007, A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. in Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007., 4160439, pp. 792-796, 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007, Bangkok, Thailand, 07-01-16. https://doi.org/10.1109/NEMS.2007.352136

A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. / Chen, Chun Hung; Lee, Yung Chun; Hsiao, Fei Bin.

Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 792-796 4160439.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

AB - We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

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