A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability

Yu chen Liu, Shih kang Lin

Research output: Contribution to journalReview article

Abstract

The electronic interconnections in the state-of-the-art integrated circuit manufacturing have been scaled down to the micron or sub-micron scale. This results in a dramatic increase in the current density passing through interconnections, which means that the electromigration (EM) effect plays a significant role in the reliability of products. Although thorough studies and reviews of EM effects have been continuously conducted in the past 60 years, some parts of EM theories lack clear elucidation of the electric current-induced non-directional effects, including electric current-induced phase equilibrium changes. This review article is intended to provide a broad picture of electric current-induced lattice stability changes and to summarize the existing literature on EM-related phenomena, EM-related theoretical models, and relevant effects of the electroplastic (EP) effect in order to lead to a better understanding of electric current-induced effects on materials. This article also posits that EM is either part of the EP effect or shares the intrinsic electric current-induced plastic deformation associated with the EP effect. This concept appears to contribute to the missing parts of the EM theories.

Original languageEnglish
Pages (from-to)3094-3106
Number of pages13
JournalJOM
Volume71
Issue number9
DOIs
Publication statusPublished - 2019 Sep 15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

Fingerprint Dive into the research topics of 'A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability'. Together they form a unique fingerprint.

  • Cite this