A Cyclic-Softening Viscoplastic Model for Considering the Temperature-Cycling Reliability of SAC305 Solder Joints

Hung Chun Yang, Tz Cheng Chiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel viscoplastic model was developed for simulating the constitutive behavior of SAC305 (Sn3.0Ag0.5Cu) solder. The model incorporates dynamic recovery functions in the kinematic hardening rule for modeling the cyclic-softening behavior of the solder. The unified viscoplastic model was discretized by following the backward Euler integration scheme and implemented as a user-defined material subroutine (USERMAT) in ANSYS. Validation of the numerical model was conducted by simulating the solder rod responses under either strain-or stress-controlled cycling and compared to experimental measurements. It was shown that the numerical simulation is capable of predicting the softening response under cyclic straining and the ratcheting response under cyclic stressing. An ANSYS model for wafer-level package (WLP) under board-level temperature cyclic condition was also developed to simulate the ball grid array (BGA) solder joint response. From the simulation, the viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the of solder joints in electronic assembly.

Original languageEnglish
Title of host publicationInternational Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
PublisherIEEE Computer Society
Pages157-160
Number of pages4
ISBN (Electronic)9781728198514
DOIs
Publication statusPublished - 2020 Oct 21
Event15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Taipei, Taiwan
Duration: 2020 Oct 212020 Oct 23

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2020-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
CountryTaiwan
CityTaipei
Period20-10-2120-10-23

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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