TY - GEN
T1 - A Cyclic-Softening Viscoplastic Model for Considering the Temperature-Cycling Reliability of SAC305 Solder Joints
AU - Yang, Hung Chun
AU - Chiu, Tz Cheng
N1 - Funding Information:
This study was supported by the Ministry of Science and Technology, ROC, under the grant MOST 109-2221-E-006-008 MY2.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/10/21
Y1 - 2020/10/21
N2 - A novel viscoplastic model was developed for simulating the constitutive behavior of SAC305 (Sn3.0Ag0.5Cu) solder. The model incorporates dynamic recovery functions in the kinematic hardening rule for modeling the cyclic-softening behavior of the solder. The unified viscoplastic model was discretized by following the backward Euler integration scheme and implemented as a user-defined material subroutine (USERMAT) in ANSYS. Validation of the numerical model was conducted by simulating the solder rod responses under either strain-or stress-controlled cycling and compared to experimental measurements. It was shown that the numerical simulation is capable of predicting the softening response under cyclic straining and the ratcheting response under cyclic stressing. An ANSYS model for wafer-level package (WLP) under board-level temperature cyclic condition was also developed to simulate the ball grid array (BGA) solder joint response. From the simulation, the viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the of solder joints in electronic assembly.
AB - A novel viscoplastic model was developed for simulating the constitutive behavior of SAC305 (Sn3.0Ag0.5Cu) solder. The model incorporates dynamic recovery functions in the kinematic hardening rule for modeling the cyclic-softening behavior of the solder. The unified viscoplastic model was discretized by following the backward Euler integration scheme and implemented as a user-defined material subroutine (USERMAT) in ANSYS. Validation of the numerical model was conducted by simulating the solder rod responses under either strain-or stress-controlled cycling and compared to experimental measurements. It was shown that the numerical simulation is capable of predicting the softening response under cyclic straining and the ratcheting response under cyclic stressing. An ANSYS model for wafer-level package (WLP) under board-level temperature cyclic condition was also developed to simulate the ball grid array (BGA) solder joint response. From the simulation, the viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the of solder joints in electronic assembly.
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U2 - 10.1109/IMPACT50485.2020.9268606
DO - 10.1109/IMPACT50485.2020.9268606
M3 - Conference contribution
AN - SCOPUS:85098197415
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 157
EP - 160
BT - International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
PB - IEEE Computer Society
T2 - 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
Y2 - 21 October 2020 through 23 October 2020
ER -