A fast thermal-aware fixed-outline floorplanning methodology based on analytical models

Jai-Ming Lin, Tai Ting Chen, Yen Fu Chang, Wei Yi Chang, Ya Ting Shyu, Yeong Jar Chang, Juin Ming Lu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.

Original languageEnglish
Title of host publication2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450359504
DOIs
Publication statusPublished - 2018 Nov 5
Event37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - San Diego, United States
Duration: 2018 Nov 52018 Nov 8

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Other

Other37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018
CountryUnited States
CitySan Diego
Period18-11-0518-11-08

Fingerprint

Analytical models
Temperature
Thermal effects
Integrated circuits
Hot Temperature
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Lin, J-M., Chen, T. T., Chang, Y. F., Chang, W. Y., Shyu, Y. T., Chang, Y. J., & Lu, J. M. (2018). A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. In 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers [a1] (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/3240765.3240769
Lin, Jai-Ming ; Chen, Tai Ting ; Chang, Yen Fu ; Chang, Wei Yi ; Shyu, Ya Ting ; Chang, Yeong Jar ; Lu, Juin Ming. / A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).
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Lin, J-M, Chen, TT, Chang, YF, Chang, WY, Shyu, YT, Chang, YJ & Lu, JM 2018, A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. in 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers., a1, IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, Institute of Electrical and Electronics Engineers Inc., 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018, San Diego, United States, 18-11-05. https://doi.org/10.1145/3240765.3240769

A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. / Lin, Jai-Ming; Chen, Tai Ting; Chang, Yen Fu; Chang, Wei Yi; Shyu, Ya Ting; Chang, Yeong Jar; Lu, Juin Ming.

2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018. a1 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lin J-M, Chen TT, Chang YF, Chang WY, Shyu YT, Chang YJ et al. A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. In 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2018. a1. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). https://doi.org/10.1145/3240765.3240769