A fast thermal-aware fixed-outline floorplanning methodology based on analytical models

Jai Ming Lin; Tai Ting Chen; Yen Fu Chang; Wei Yi Chang; Ya Ting Shyu; Yeong Jar Chang; Juin Ming Lu

doi:10.1145/3240765.3240769

A fast thermal-aware fixed-outline floorplanning methodology based on analytical models

Jai Ming Lin, Tai Ting Chen, Yen Fu Chang, Wei Yi Chang, Ya Ting Shyu, Yeong Jar Chang, Juin Ming Lu

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.

Original language	English
Title of host publication	2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781450359504
DOIs	https://doi.org/10.1145/3240765.3240769
Publication status	Published - 2018 Nov 5
Event	37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - San Diego, United States Duration: 2018 Nov 5 → 2018 Nov 8

Publication series

Name	IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)	1092-3152

Other

Other	37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018
Country/Territory	United States
City	San Diego
Period	18-11-05 → 18-11-08

All Science Journal Classification (ASJC) codes

Software
Computer Science Applications
Computer Graphics and Computer-Aided Design

Access to Document

10.1145/3240765.3240769

Cite this

Lin, J. M., Chen, T. T., Chang, Y. F., Chang, W. Y., Shyu, Y. T., Chang, Y. J., & Lu, J. M. (2018). A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. In 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers [a1] (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/3240765.3240769

Lin, Jai Ming ; Chen, Tai Ting ; Chang, Yen Fu ; Chang, Wei Yi ; Shyu, Ya Ting ; Chang, Yeong Jar ; Lu, Juin Ming. / A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

@inproceedings{f6f69a8e7be042f8aaf61b94c576bf36,

title = "A fast thermal-aware fixed-outline floorplanning methodology based on analytical models",

abstract = "High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.",

author = "Lin, {Jai Ming} and Chen, {Tai Ting} and Chang, {Yen Fu} and Chang, {Wei Yi} and Shyu, {Ya Ting} and Chang, {Yeong Jar} and Lu, {Juin Ming}",

note = "Funding Information: This work was partially supported by the National Science Council of Taiwan ROC under Grant No. MOST 106-2221-E-006-236-MY2. Publisher Copyright: {\textcopyright} 2018 ACM.; 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 ; Conference date: 05-11-2018 Through 08-11-2018",

year = "2018",

month = nov,

day = "5",

doi = "10.1145/3240765.3240769",

language = "English",

series = "IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers",

address = "United States",

}

Lin, JM, Chen, TT, Chang, YF, Chang, WY, Shyu, YT, Chang, YJ & Lu, JM 2018, A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. in 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers., a1, IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, Institute of Electrical and Electronics Engineers Inc., 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018, San Diego, United States, 18-11-05. https://doi.org/10.1145/3240765.3240769

A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. / Lin, Jai Ming; Chen, Tai Ting; Chang, Yen Fu; Chang, Wei Yi; Shyu, Ya Ting; Chang, Yeong Jar; Lu, Juin Ming.

2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018. a1 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A fast thermal-aware fixed-outline floorplanning methodology based on analytical models

AU - Lin, Jai Ming

AU - Chen, Tai Ting

AU - Chang, Yen Fu

AU - Chang, Wei Yi

AU - Shyu, Ya Ting

AU - Chang, Yeong Jar

AU - Lu, Juin Ming

PY - 2018/11/5

Y1 - 2018/11/5

N2 - High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.

AB - High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.

UR - http://www.scopus.com/inward/record.url?scp=85058165301&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85058165301&partnerID=8YFLogxK

U2 - 10.1145/3240765.3240769

DO - 10.1145/3240765.3240769

M3 - Conference contribution

AN - SCOPUS:85058165301

T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

BT - 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018

Y2 - 5 November 2018 through 8 November 2018

ER -

Lin JM, Chen TT, Chang YF, Chang WY, Shyu YT, Chang YJ et al. A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. In 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2018. a1. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). https://doi.org/10.1145/3240765.3240769

A fast thermal-aware fixed-outline floorplanning methodology based on analytical models

Abstract

Publication series

Other

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this