Abstract
High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.
| Original language | English |
|---|---|
| Title of host publication | 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781450359504 |
| DOIs | |
| Publication status | Published - 2018 Nov 5 |
| Event | 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - San Diego, United States Duration: 2018 Nov 5 → 2018 Nov 8 |
Publication series
| Name | IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD |
|---|---|
| ISSN (Print) | 1092-3152 |
Other
| Other | 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 |
|---|---|
| Country | United States |
| City | San Diego |
| Period | 18-11-05 → 18-11-08 |
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All Science Journal Classification (ASJC) codes
- Software
- Computer Science Applications
- Computer Graphics and Computer-Aided Design
Cite this
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A fast thermal-aware fixed-outline floorplanning methodology based on analytical models. / Lin, Jai-Ming; Chen, Tai Ting; Chang, Yen Fu; Chang, Wei Yi; Shyu, Ya Ting; Chang, Yeong Jar; Lu, Juin Ming.
2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018. a1 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A fast thermal-aware fixed-outline floorplanning methodology based on analytical models
AU - Lin, Jai-Ming
AU - Chen, Tai Ting
AU - Chang, Yen Fu
AU - Chang, Wei Yi
AU - Shyu, Ya Ting
AU - Chang, Yeong Jar
AU - Lu, Juin Ming
PY - 2018/11/5
Y1 - 2018/11/5
N2 - High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.
AB - High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.
UR - http://www.scopus.com/inward/record.url?scp=85058165301&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85058165301&partnerID=8YFLogxK
U2 - 10.1145/3240765.3240769
DO - 10.1145/3240765.3240769
M3 - Conference contribution
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
BT - 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
ER -