Abstract
In this paper, we report a new alternative to the conventional solder. It is based on In-Sn multilayer composite design. This is a fluxless, oxidation-free, and most important of all, non-eutectic soldering technique that can achieve a remelting temperature significantly higher than the bonding temperature. The In-Sn non-eutectic multilayer alloy so designed has the composition of 13.9 atomic % In and 86.1 atomic % Sn. The SEM and EDX analyses performed on the joint cross section clearly indicate a uniform joint thickness of 9μm, while the joint microstructure is clearly visible and nearly void-free. The EDX results obtained also successfully demonstrate that the entire joint is heavily Sn-rich, as what we have anticipated. It ranges from 175 to 190°C. The results clear show that the joint composition is heavily Sn-rich, a very significant advantage from which it maximizes the temperature tolerance the device package can possibly handle.
Original language | English |
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Pages (from-to) | 671-674 |
Number of pages | 4 |
Journal | Proceedings - Electronic Components and Technology Conference |
Publication status | Published - 2001 |
Event | 51st Electronic Components and Technology Conference - Orlando, FL, United States Duration: 2001 May 29 → 2001 Jun 1 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering