A fluxless Sn-In bonding process achieving high re-melting temperature

Wen-Kuei Chuang, S. Choe, C. C. Lee

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

In this paper, we report a new alternative to the conventional solder. It is based on In-Sn multilayer composite design. This is a fluxless, oxidation-free, and most important of all, non-eutectic soldering technique that can achieve a remelting temperature significantly higher than the bonding temperature. The In-Sn non-eutectic multilayer alloy so designed has the composition of 13.9 atomic % In and 86.1 atomic % Sn. The SEM and EDX analyses performed on the joint cross section clearly indicate a uniform joint thickness of 9μm, while the joint microstructure is clearly visible and nearly void-free. The EDX results obtained also successfully demonstrate that the entire joint is heavily Sn-rich, as what we have anticipated. It ranges from 175 to 190°C. The results clear show that the joint composition is heavily Sn-rich, a very significant advantage from which it maximizes the temperature tolerance the device package can possibly handle.

Original languageEnglish
Pages (from-to)671-674
Number of pages4
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 2001 Jan 1
Event51st Electronic Components and Technology Conference - Orlando, FL, United States
Duration: 2001 May 292001 Jun 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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