A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

Wei Te Liu; Chia Ming Yang; Tz Cheng Chiu; Dao Long Chen; Ching Lin Hsiao; David Tarng

doi:10.1109/ECTC32696.2021.00140

A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

Wei Te Liu
, Chia Ming Yang
, Tz Cheng Chiu
, Dao Long Chen
, Ching Lin Hsiao
, David Tarng

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

13 Citations (Scopus)

Abstract

In this study, the risk of debonding failure of the Cu-polyimide structure prepared by using realistic redistribution processes were investigated. The constitutive behavior of the polyimide thin film was first evaluated under tensile loading conditions at various temperatures. It was shown that the polyimide thin film with low glass transition temperature exhibits obvious viscoelastic response. A generalized Maxwell model was adopted to describe the thermoviscoelastic behavior. The debonding growth behavior of the Cu-polyimide interface was then investigated by using the double cantilever beam fracture mechanics tests. A finite-element based numerical model was then developed to evaluate the debonding growth at the Cu-polyimide interface and to investigate the effects of inelastic energy dissipations in the Cu and polyimide layers on the debonding response of the layered structure. The model can be applied to consider complex fan-out designs and would allow development of design rules for extending the Cu-polyimide based redistribution interconnect technology to the regimes of higher I/O densities.

Original language	English
Title of host publication	Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	816-822
Number of pages	7
ISBN (Electronic)	9780738145235
DOIs	https://doi.org/10.1109/ECTC32696.2021.00140
Publication status	Published - 2021
Event	71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States Duration: 2021 Jun 1 → 2021 Jul 4

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2021-June
ISSN (Print)	0569-5503

Conference

Conference	71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/Territory	United States
City	Virtual, Online
Period	21-06-01 → 21-07-04

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC32696.2021.00140

Cite this

Liu, W. T., Yang, C. M., Chiu, T. C., Chen, D. L., Hsiao, C. L., & Tarng, D. (2021). A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect. In Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021 (pp. 816-822). (Proceedings - Electronic Components and Technology Conference; Vol. 2021-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC32696.2021.00140

Liu, Wei Te ; Yang, Chia Ming ; Chiu, Tz Cheng et al. / A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect. Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 816-822 (Proceedings - Electronic Components and Technology Conference).

@inproceedings{f17e71497c7c4db88a255b58bc4574de,

title = "A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect",

abstract = "In this study, the risk of debonding failure of the Cu-polyimide structure prepared by using realistic redistribution processes were investigated. The constitutive behavior of the polyimide thin film was first evaluated under tensile loading conditions at various temperatures. It was shown that the polyimide thin film with low glass transition temperature exhibits obvious viscoelastic response. A generalized Maxwell model was adopted to describe the thermoviscoelastic behavior. The debonding growth behavior of the Cu-polyimide interface was then investigated by using the double cantilever beam fracture mechanics tests. A finite-element based numerical model was then developed to evaluate the debonding growth at the Cu-polyimide interface and to investigate the effects of inelastic energy dissipations in the Cu and polyimide layers on the debonding response of the layered structure. The model can be applied to consider complex fan-out designs and would allow development of design rules for extending the Cu-polyimide based redistribution interconnect technology to the regimes of higher I/O densities.",

author = "Liu, \{Wei Te\} and Yang, \{Chia Ming\} and Chiu, \{Tz Cheng\} and Chen, \{Dao Long\} and Hsiao, \{Ching Lin\} and David Tarng",

note = "Funding Information: ACKNOWLEDGMENT This study was supported by ASE Group, and by the Ministry of Science and Technology, ROC, under the grant MOST 109-2221-E-006-008-MY2. Support from the ASE Materials Lab for DMA measurements is greatly appreciated. Publisher Copyright: {\textcopyright} 2021 IEEE; 71st IEEE Electronic Components and Technology Conference, ECTC 2021 ; Conference date: 01-06-2021 Through 04-07-2021",

year = "2021",

doi = "10.1109/ECTC32696.2021.00140",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "816--822",

booktitle = "Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021",

address = "United States",

}

Liu, WT, Yang, CM , Chiu, TC, Chen, DL, Hsiao, CL & Tarng, D 2021, A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect. in Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Proceedings - Electronic Components and Technology Conference, vol. 2021-June, Institute of Electrical and Electronics Engineers Inc., pp. 816-822, 71st IEEE Electronic Components and Technology Conference, ECTC 2021, Virtual, Online, United States, 21-06-01. https://doi.org/10.1109/ECTC32696.2021.00140

A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect. / Liu, Wei Te; Yang, Chia Ming ; Chiu, Tz Cheng et al.
Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 816-822 (Proceedings - Electronic Components and Technology Conference; Vol. 2021-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

AU - Liu, Wei Te

AU - Yang, Chia Ming

AU - Chiu, Tz Cheng

AU - Chen, Dao Long

AU - Hsiao, Ching Lin

AU - Tarng, David

N1 - Funding Information: ACKNOWLEDGMENT This study was supported by ASE Group, and by the Ministry of Science and Technology, ROC, under the grant MOST 109-2221-E-006-008-MY2. Support from the ASE Materials Lab for DMA measurements is greatly appreciated. Publisher Copyright: © 2021 IEEE

PY - 2021

Y1 - 2021

N2 - In this study, the risk of debonding failure of the Cu-polyimide structure prepared by using realistic redistribution processes were investigated. The constitutive behavior of the polyimide thin film was first evaluated under tensile loading conditions at various temperatures. It was shown that the polyimide thin film with low glass transition temperature exhibits obvious viscoelastic response. A generalized Maxwell model was adopted to describe the thermoviscoelastic behavior. The debonding growth behavior of the Cu-polyimide interface was then investigated by using the double cantilever beam fracture mechanics tests. A finite-element based numerical model was then developed to evaluate the debonding growth at the Cu-polyimide interface and to investigate the effects of inelastic energy dissipations in the Cu and polyimide layers on the debonding response of the layered structure. The model can be applied to consider complex fan-out designs and would allow development of design rules for extending the Cu-polyimide based redistribution interconnect technology to the regimes of higher I/O densities.

AB - In this study, the risk of debonding failure of the Cu-polyimide structure prepared by using realistic redistribution processes were investigated. The constitutive behavior of the polyimide thin film was first evaluated under tensile loading conditions at various temperatures. It was shown that the polyimide thin film with low glass transition temperature exhibits obvious viscoelastic response. A generalized Maxwell model was adopted to describe the thermoviscoelastic behavior. The debonding growth behavior of the Cu-polyimide interface was then investigated by using the double cantilever beam fracture mechanics tests. A finite-element based numerical model was then developed to evaluate the debonding growth at the Cu-polyimide interface and to investigate the effects of inelastic energy dissipations in the Cu and polyimide layers on the debonding response of the layered structure. The model can be applied to consider complex fan-out designs and would allow development of design rules for extending the Cu-polyimide based redistribution interconnect technology to the regimes of higher I/O densities.

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DO - 10.1109/ECTC32696.2021.00140

M3 - Conference contribution

AN - SCOPUS:85124660603

T3 - Proceedings - Electronic Components and Technology Conference

SP - 816

EP - 822

BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021

Y2 - 1 June 2021 through 4 July 2021

ER -

Liu WT, Yang CM , Chiu TC, Chen DL, Hsiao CL, Tarng D. A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect. In Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 816-822. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC32696.2021.00140

A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

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