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A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
- Wei Te Liu
- , Chia Ming Yang
- , Tz Cheng Chiu
- , Dao Long Chen
- , Ching Lin Hsiao
- , David Tarng
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
13
Citations
(Scopus)