TY - GEN
T1 - A framework of equipment maintenance and service with application to wire bonder
AU - Chang, Ren Jung
AU - Hsieh, Yu Tsang
AU - Chang, Eric
PY - 2009/11/4
Y1 - 2009/11/4
N2 - A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.
AB - A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.
UR - http://www.scopus.com/inward/record.url?scp=70350459708&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70350459708&partnerID=8YFLogxK
U2 - 10.1109/AIM.2009.5229868
DO - 10.1109/AIM.2009.5229868
M3 - Conference contribution
AN - SCOPUS:70350459708
SN - 9781424428533
T3 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
SP - 1498
EP - 1503
BT - 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
T2 - 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
Y2 - 14 July 2009 through 17 July 2009
ER -