A framework of equipment maintenance and service with application to wire bonder

Ren Jung Chang; Yu Tsang Hsieh; Eric Chang

doi:10.1109/AIM.2009.5229868

A framework of equipment maintenance and service with application to wire bonder

Ren Jung Chang, Yu Tsang Hsieh, Eric Chang

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.

Original language	English
Title of host publication	2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
Pages	1498-1503
Number of pages	6
DOIs	https://doi.org/10.1109/AIM.2009.5229868
Publication status	Published - 2009 Nov 4
Event	2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 - Singapore, Singapore Duration: 2009 Jul 14 → 2009 Jul 17

Publication series

Name	IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Other

Other	2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
Country	Singapore
City	Singapore
Period	09-07-14 → 09-07-17

All Science Journal Classification (ASJC) codes

Control and Systems Engineering
Software
Computer Science Applications
Electrical and Electronic Engineering

Access to Document

10.1109/AIM.2009.5229868

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Cite this

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title = "A framework of equipment maintenance and service with application to wire bonder",

abstract = "A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.",

author = "Chang, {Ren Jung} and Hsieh, {Yu Tsang} and Eric Chang",

year = "2009",

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booktitle = "2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009",

note = "2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 ; Conference date: 14-07-2009 Through 17-07-2009",

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Chang, RJ, Hsieh, YT & Chang, E 2009, A framework of equipment maintenance and service with application to wire bonder. in 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009., 5229868, IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM, pp. 1498-1503, 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009, Singapore, Singapore, 09-07-14. https://doi.org/10.1109/AIM.2009.5229868

A framework of equipment maintenance and service with application to wire bonder. / Chang, Ren Jung; Hsieh, Yu Tsang; Chang, Eric.

2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009. 2009. p. 1498-1503 5229868 (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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