A framework of equipment maintenance and service with application to wire bonder

Ren-Jung Chang, Yu Tsang Hsieh, Eric Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.

Original languageEnglish
Title of host publication2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
Pages1498-1503
Number of pages6
DOIs
Publication statusPublished - 2009 Nov 4
Event2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 - Singapore, Singapore
Duration: 2009 Jul 142009 Jul 17

Publication series

NameIEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Other

Other2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
CountrySingapore
CitySingapore
Period09-07-1409-07-17

Fingerprint

Wire
Quality function deployment
Taguchi methods
Value engineering
Mechatronics
Failure analysis
Semiconductor materials

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Chang, R-J., Hsieh, Y. T., & Chang, E. (2009). A framework of equipment maintenance and service with application to wire bonder. In 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 (pp. 1498-1503). [5229868] (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM). https://doi.org/10.1109/AIM.2009.5229868
Chang, Ren-Jung ; Hsieh, Yu Tsang ; Chang, Eric. / A framework of equipment maintenance and service with application to wire bonder. 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009. 2009. pp. 1498-1503 (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM).
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Chang, R-J, Hsieh, YT & Chang, E 2009, A framework of equipment maintenance and service with application to wire bonder. in 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009., 5229868, IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM, pp. 1498-1503, 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009, Singapore, Singapore, 09-07-14. https://doi.org/10.1109/AIM.2009.5229868

A framework of equipment maintenance and service with application to wire bonder. / Chang, Ren-Jung; Hsieh, Yu Tsang; Chang, Eric.

2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009. 2009. p. 1498-1503 5229868 (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.

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Chang R-J, Hsieh YT, Chang E. A framework of equipment maintenance and service with application to wire bonder. In 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009. 2009. p. 1498-1503. 5229868. (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM). https://doi.org/10.1109/AIM.2009.5229868