Abstract
A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.
| Original language | English |
|---|---|
| Title of host publication | 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 |
| Pages | 1498-1503 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2009 Nov 4 |
| Event | 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 - Singapore, Singapore Duration: 2009 Jul 14 → 2009 Jul 17 |
Publication series
| Name | IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM |
|---|
Other
| Other | 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 |
|---|---|
| Country | Singapore |
| City | Singapore |
| Period | 09-07-14 → 09-07-17 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Software
- Computer Science Applications
- Electrical and Electronic Engineering
Cite this
}
A framework of equipment maintenance and service with application to wire bonder. / Chang, Ren-Jung; Hsieh, Yu Tsang; Chang, Eric.
2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009. 2009. p. 1498-1503 5229868 (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A framework of equipment maintenance and service with application to wire bonder
AU - Chang, Ren-Jung
AU - Hsieh, Yu Tsang
AU - Chang, Eric
PY - 2009/11/4
Y1 - 2009/11/4
N2 - A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.
AB - A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.
UR - http://www.scopus.com/inward/record.url?scp=70350459708&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70350459708&partnerID=8YFLogxK
U2 - 10.1109/AIM.2009.5229868
DO - 10.1109/AIM.2009.5229868
M3 - Conference contribution
SN - 9781424428533
T3 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
SP - 1498
EP - 1503
BT - 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
ER -