A framework of equipment maintenance and service with application to wire bonder

Ren Jung Chang, Yu Tsang Hsieh, Eric Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.

Original languageEnglish
Title of host publication2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
Pages1498-1503
Number of pages6
DOIs
Publication statusPublished - 2009 Nov 4
Event2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009 - Singapore, Singapore
Duration: 2009 Jul 142009 Jul 17

Publication series

NameIEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Other

Other2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
CountrySingapore
CitySingapore
Period09-07-1409-07-17

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Computer Science Applications
  • Electrical and Electronic Engineering

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