A flexible electronics sensor for large area sensing was developed using a screen printing technology with the thixotropy sol-gel materials to form the microstructure patterns on two polyimide (PI) sheets. A flexible sensor is 150× 150 mm2, including posts, resistances, bumps, and electrode traces. The space between the top electrode and the resistance layer provided a buffer distance for large bending. Experimental results show that array microstructures have good morphological profiles at a screen speed of 10 mm/s, a squeegee pressure of 213 kPa, and a separation speed of 0.4 mm/s using the print-print mode. A membrane with a bump protrusion had a large displacement and a quick sensitive response because the bump provided a concentrated force of von Mises stress on the membrane center. For printing thick structures, diffusion effects and dimensional shrinkages can be reduced when a paste material with a higher viscosity is used. The results exhibit a potential for using in the flexible sensing and higher temperatures. In additional, the fabrication is the low cost and potential higher throughput in flexible electronics applications.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering