A Low-cost horizontal current bipolar transistor (HCBT) technology for the BiCMOS integration with FinFETs

Tomislav Suligoj, Haitao Liu, Johnny K.O. Sin, Kenneth Tsni, Kevin J. Chen, Perar Biljanovic, Kong L. Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The new pillar-like structures, such as vertical memory cells and FinFETs [ 1] are introduced as the end-of-scaling devices for the improvement of the MOSFETs characteristics and for the reduction of the chip area consumption. Bipolar transistors are needed for the integration with those devices for the future mixed-signal system-on-a-chip applications. We develop a Horizontal Current Bipolar Transistor (HCBT) suitable for such an integration [2] since its active device region is processed in the n-hill sidewall. In this paper, we present a scaled transistor processed with the improved technology, resulting in the enhancement of its electrical performance. In comparison with the existing Lateral Bipolar Transistors (LBTs) [3-5], the HCBT exhibits the highest fr and the highest ftBVceo product reported in the literature so far.

Original languageEnglish
Title of host publication2003 International Semiconductor Device Research Symposium, ISDRS 2003 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages518-519
Number of pages2
ISBN (Electronic)0780381394, 9780780381391
DOIs
Publication statusPublished - 2003
EventInternational Semiconductor Device Research Symposium, ISDRS 2003 - Washington, United States
Duration: 2003 Dec 102003 Dec 12

Publication series

Name2003 International Semiconductor Device Research Symposium, ISDRS 2003 - Proceedings

Other

OtherInternational Semiconductor Device Research Symposium, ISDRS 2003
Country/TerritoryUnited States
CityWashington
Period03-12-1003-12-12

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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