@inproceedings{88574275134144a68e9e0398cd357c57,
title = "A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package",
abstract = "The effect of moisture absorption on the risk of interface delamination in a fan-out (FO) wafer level package (WLP) was investigated by using experimental and numerical analyses. A double-cantilever-beam (DCB) fracture mechanics test was applied to quantify the degradation of interfacial debonding resistance due to moisture exposure. The driving forces of delamination on various interfaces in the FO WLP were evaluated by using a coupled hygro-thermo-mechanical model. The moisture diffusion related material models such as diffusivity, saturation concentration and the hygroscopic swelling of the polymer constituents in the FO package were characterized experimentally and implemented in the numerical stress model. The numerical model was applied to evaluate the transient stress evolutions at critical locations around the corners of the Si die during moisture sensitivity tests. It was observed that the moisture absorption degrades adhesion significantly. It also leads to a change in stress state around the corners of Si die from compression to tension, and as a result, significantly increase the risk of delamination.",
author = "Chiu, {Tz Cheng} and Wu, {Ji Yen} and Liu, {Wei Te} and Liu, {Chang Wei} and Chen, {Dao Long} and Shih, {Meng Kai} and David Tarng",
note = "Funding Information: ACKNOWLEDGMENT This study was supported by ASE Group, and by the Ministry of Science and Technology, ROC, under the grant MOST 107-2221-E-006-138. Publisher Copyright: {\textcopyright} 2020 IEEE.; 70th IEEE Electronic Components and Technology Conference, ECTC 2020 ; Conference date: 03-06-2020 Through 30-06-2020",
year = "2020",
month = jun,
doi = "10.1109/ECTC32862.2020.00193",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1205--1211",
booktitle = "Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020",
address = "United States",
}