A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

Tz Cheng Chiu, Ji Yen Wu, Wei Te Liu, Chang Wei Liu, Dao Long Chen, Meng Kai Shih, David Tarng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of moisture absorption on the risk of interface delamination in a fan-out (FO) wafer level package (WLP) was investigated by using experimental and numerical analyses. A double-cantilever-beam (DCB) fracture mechanics test was applied to quantify the degradation of interfacial debonding resistance due to moisture exposure. The driving forces of delamination on various interfaces in the FO WLP were evaluated by using a coupled hygro-thermo-mechanical model. The moisture diffusion related material models such as diffusivity, saturation concentration and the hygroscopic swelling of the polymer constituents in the FO package were characterized experimentally and implemented in the numerical stress model. The numerical model was applied to evaluate the transient stress evolutions at critical locations around the corners of the Si die during moisture sensitivity tests. It was observed that the moisture absorption degrades adhesion significantly. It also leads to a change in stress state around the corners of Si die from compression to tension, and as a result, significantly increase the risk of delamination.

Original languageEnglish
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1205-1211
Number of pages7
ISBN (Electronic)9781728161808
DOIs
Publication statusPublished - 2020 Jun
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 2020 Jun 32020 Jun 30

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period20-06-0320-06-30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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