TY - GEN
T1 - A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems
AU - Tseng, Hsien Cheng
AU - Lee, Pei Hsuan
AU - Chou, Jung Hua
PY - 2008
Y1 - 2008
N2 - A heat-dissipation packaging configuration of GalnP collector-up (C-up) heterojunction bipolar transistors (HBTs) has been designed and evaluated systematically. 2-D and 3-D finite-element modeling (FEM) approaches are built up to simulate the actual devices and to analyze the temperature distribution behavior. The results show that the reported configuration can be further reduced by 42%. Therefore, thinning the thermal-via structure constructed in GalnP collector-up HBTs should be useful for miniaturization of high-power amplifier (HPA) designs, and the developed FEM method can be very effective for optimizing HBT-based HPAs in future cellular phone systems.
AB - A heat-dissipation packaging configuration of GalnP collector-up (C-up) heterojunction bipolar transistors (HBTs) has been designed and evaluated systematically. 2-D and 3-D finite-element modeling (FEM) approaches are built up to simulate the actual devices and to analyze the temperature distribution behavior. The results show that the reported configuration can be further reduced by 42%. Therefore, thinning the thermal-via structure constructed in GalnP collector-up HBTs should be useful for miniaturization of high-power amplifier (HPA) designs, and the developed FEM method can be very effective for optimizing HBT-based HPAs in future cellular phone systems.
UR - http://www.scopus.com/inward/record.url?scp=64049103622&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=64049103622&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2008.4783887
DO - 10.1109/IMPACT.2008.4783887
M3 - Conference contribution
AN - SCOPUS:64049103622
SN - 9781424436248
T3 - 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
SP - 364
EP - 366
BT - 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
T2 - 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
Y2 - 22 October 2008 through 24 October 2008
ER -