A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems

Hsien Cheng Tseng; Pei Hsuan Lee; Jung Hua Chou

doi:10.1109/IMPACT.2008.4783887

A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems

Hsien Cheng Tseng, Pei Hsuan Lee, Jung Hua Chou

Department of Engineering Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

A heat-dissipation packaging configuration of GalnP collector-up (C-up) heterojunction bipolar transistors (HBTs) has been designed and evaluated systematically. 2-D and 3-D finite-element modeling (FEM) approaches are built up to simulate the actual devices and to analyze the temperature distribution behavior. The results show that the reported configuration can be further reduced by 42%. Therefore, thinning the thermal-via structure constructed in GalnP collector-up HBTs should be useful for miniaturization of high-power amplifier (HPA) designs, and the developed FEM method can be very effective for optimizing HBT-based HPAs in future cellular phone systems.

Original language	English
Title of host publication	2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
Pages	364-366
Number of pages	3
DOIs	https://doi.org/10.1109/IMPACT.2008.4783887
Publication status	Published - 2008 Dec 1
Event	2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 - Taipei, Taiwan Duration: 2008 Oct 22 → 2008 Oct 24

Publication series

Name	2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Other

Other	2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
Country	Taiwan
City	Taipei
Period	08-10-22 → 08-10-24

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/IMPACT.2008.4783887

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Tseng, H. C., Lee, P. H., & Chou, J. H. (2008). A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems. In 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 (pp. 364-366). [4783887] (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008). https://doi.org/10.1109/IMPACT.2008.4783887

Tseng, Hsien Cheng ; Lee, Pei Hsuan ; Chou, Jung Hua. / A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems. 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. 2008. pp. 364-366 (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008).

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title = "A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems",

abstract = "A heat-dissipation packaging configuration of GalnP collector-up (C-up) heterojunction bipolar transistors (HBTs) has been designed and evaluated systematically. 2-D and 3-D finite-element modeling (FEM) approaches are built up to simulate the actual devices and to analyze the temperature distribution behavior. The results show that the reported configuration can be further reduced by 42%. Therefore, thinning the thermal-via structure constructed in GalnP collector-up HBTs should be useful for miniaturization of high-power amplifier (HPA) designs, and the developed FEM method can be very effective for optimizing HBT-based HPAs in future cellular phone systems.",

author = "Tseng, {Hsien Cheng} and Lee, {Pei Hsuan} and Chou, {Jung Hua}",

year = "2008",

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booktitle = "2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008",

note = "2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 ; Conference date: 22-10-2008 Through 24-10-2008",

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Tseng, HC, Lee, PH & Chou, JH 2008, A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems. in 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008., 4783887, 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008, pp. 364-366, 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008, Taipei, Taiwan, 08-10-22. https://doi.org/10.1109/IMPACT.2008.4783887

A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems. / Tseng, Hsien Cheng; Lee, Pei Hsuan; Chou, Jung Hua.

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. 2008. p. 364-366 4783887 (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - A heat-dissipation packaging configuration of GalnP collector-up (C-up) heterojunction bipolar transistors (HBTs) has been designed and evaluated systematically. 2-D and 3-D finite-element modeling (FEM) approaches are built up to simulate the actual devices and to analyze the temperature distribution behavior. The results show that the reported configuration can be further reduced by 42%. Therefore, thinning the thermal-via structure constructed in GalnP collector-up HBTs should be useful for miniaturization of high-power amplifier (HPA) designs, and the developed FEM method can be very effective for optimizing HBT-based HPAs in future cellular phone systems.

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Tseng HC, Lee PH, Chou JH. A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems. In 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. 2008. p. 364-366. 4783887. (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008). https://doi.org/10.1109/IMPACT.2008.4783887