A Modal Analysis of Innovation Intermediary in the Open Innovation System

Chia-Han Yang, Joseph Z. Shyu., Jou-Chen Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationInternational Society for Professional Innovation Management (ISPIM) on: Open Innovation
Place of PublicationTours, France
Publication statusPublished - 2008

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Yang, C-H., Joseph Z. Shyu., & Chen, J-C. (2008). A Modal Analysis of Innovation Intermediary in the Open Innovation System. In International Society for Professional Innovation Management (ISPIM) on: Open Innovation