Abstract
Indentation forces, including constant rate and oscillating mode, were applied to SiO2/Si and diamond-like carbon (DLC)/Si specimens. A two-stage behavior was exhibited in the force-depth results after delamination occurred. When the depth was smaller than the threshold value, a linear load-depth relationship was exhibited because the debonded film was suspended over the substrate. Membrane theory was applied to analyze the deflection of the suspended film, and thus the in-plane stress exhibited in the debonded film was evaluated. Through the proposed method, the strain energy release rate of the interface can be directly evaluated by analyzing the force-depth data of the indentation tests.
Original language | English |
---|---|
Article number | 025701 |
Journal | Nanotechnology |
Volume | 20 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2009 Jan 14 |
All Science Journal Classification (ASJC) codes
- Bioengineering
- General Chemistry
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering