A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

C. F. Chuang, K. S. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Flawless glass cutting is traditional important task for related applications ranged from large scale window application to small scale mobile display device assembly. Recently, the cutting of strengthened glass becomes critical due to their residual tensile stress. This paper describes a novel technique for dealing cutting inner holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates the picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Experimental results indicate that the proposed method could achieve successful separations for various enclosed shapes with the surface roughness satisfying the requirement. However, temperature control is critical. Currently, the associated thermo- mechanical finite element analyses are conducted for optimizing the process design.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
EditorsRomolo Marcelli, Yoshio Mita, Stewart Smith, Francis Pressecq, Pascal Nouet, Frederick Mailly, Peter Schneider
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
ISBN (Electronic)9781538661994
DOIs
Publication statusPublished - 2018 Jun 22
Event20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 - Roma, Italy
Duration: 2018 May 222018 May 25

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018

Other

Other20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
CountryItaly
CityRoma
Period18-05-2218-05-25

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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  • Cite this

    Chuang, C. F., & Chen, K. S. (2018). A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation. In R. Marcelli, Y. Mita, S. Smith, F. Pressecq, P. Nouet, F. Mailly, & P. Schneider (Eds.), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018 (pp. 1-5). (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2018.8394207