TY - GEN
T1 - A novel approach for forming ductile Cu-to-Cu interconnection
AU - Yeh, Che Yu
AU - Kuo, Yi Kai
AU - Lin, Shih Kang
N1 - Funding Information:
The authors wish to thank the financial supports from the Ministry of Science and Technology (MOST), Taiwan under the projects NSC 101-2221-E-006-113, MOST 103-2221-E-006-043-MY3, and MOST 104-2119-M-006-012
Publisher Copyright:
© 2016 The Japan Institute of Electronics Packaging.
PY - 2016/6/7
Y1 - 2016/6/7
N2 - Three-dimensional integrated-circuit (3D IC) is one of the most important electronic packaging technologies nowadays. Cu-to-Cu through-silicon-via interconnection is a crucial process in 3D IC. Direct Cu-to-Cu bonding has been a challenging process for the industry due to its strict requirements on processing conditions and corresponding high processing costs. Micro-bumping is a widely used method for Cu-to-Cu bonding. Cheap and fast process are its advantages, and it has been a mature process in electronic industry. However, intermetallic compounds (IMCs) usually form at solder joints, which are brittle and electrical resistant. Filler materials that help forming Cu-to-Cu joints with better reliability and lower costs are demanding. In this article, a critical review on Cu-to-Cu interconnection technology is presented and an approach for fabricating ductile Cu-to-Cu 3D IC joints is proposed.
AB - Three-dimensional integrated-circuit (3D IC) is one of the most important electronic packaging technologies nowadays. Cu-to-Cu through-silicon-via interconnection is a crucial process in 3D IC. Direct Cu-to-Cu bonding has been a challenging process for the industry due to its strict requirements on processing conditions and corresponding high processing costs. Micro-bumping is a widely used method for Cu-to-Cu bonding. Cheap and fast process are its advantages, and it has been a mature process in electronic industry. However, intermetallic compounds (IMCs) usually form at solder joints, which are brittle and electrical resistant. Filler materials that help forming Cu-to-Cu joints with better reliability and lower costs are demanding. In this article, a critical review on Cu-to-Cu interconnection technology is presented and an approach for fabricating ductile Cu-to-Cu 3D IC joints is proposed.
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U2 - 10.1109/ICEP.2016.7486873
DO - 10.1109/ICEP.2016.7486873
M3 - Conference contribution
AN - SCOPUS:84978304056
T3 - 2016 International Conference on Electronics Packaging, ICEP 2016
SP - 479
EP - 484
BT - 2016 International Conference on Electronics Packaging, ICEP 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 International Conference on Electronics Packaging, ICEP 2016
Y2 - 20 April 2016 through 22 April 2016
ER -