A Novel Composite Material for Electronic Packaging

A novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metailic layer(s) on the diamond surface is described in this paper. The carbon/carbon composite was processed by pitch infiltration into vapour grown carbon fibre preform. Diamond coatings were then applied to the composite using a microwave enhanced chemical vapour deposition technique. Surface metallisation on the diamond coatings was performed using an electron beam evaporation technique. Characterisations including microstructure, thermal conductivity, diamond coating quality and thickness of metallised layer were carried out.