A Novel Composite Material for Electronic Packaging

Jyh-Ming Ting, M. L. Lake

Research output: Contribution to journalReview article

1 Citation (Scopus)

Abstract

A novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metailic layer(s) on the diamond surface is described in this paper. The carbon/carbon composite was processed by pitch infiltration into vapour grown carbon fibre preform. Diamond coatings were then applied to the composite using a microwave enhanced chemical vapour deposition technique. Surface metallisation on the diamond coatings was performed using an electron beam evaporation technique. Characterisations including microstructure, thermal conductivity, diamond coating quality and thickness of metallised layer were carried out.

Original languageEnglish
Pages (from-to)30-31
Number of pages2
JournalMicroelectronics International: An International Journal
Volume12
Issue number2
DOIs
Publication statusPublished - 1995 Feb 1

Fingerprint

electronic packaging
Diamond
Electronics packaging
Diamonds
diamonds
composite materials
Composite materials
carbon-carbon composites
Carbon carbon composites
coatings
Coatings
preforms
heat sinks
Heat sinks
infiltration
carbon fibers
Metallizing
Infiltration
Carbon fibers
Chemical vapor deposition

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

@article{af1becfa24d54a6885abd0c6f1420965,
title = "A Novel Composite Material for Electronic Packaging",
abstract = "A novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metailic layer(s) on the diamond surface is described in this paper. The carbon/carbon composite was processed by pitch infiltration into vapour grown carbon fibre preform. Diamond coatings were then applied to the composite using a microwave enhanced chemical vapour deposition technique. Surface metallisation on the diamond coatings was performed using an electron beam evaporation technique. Characterisations including microstructure, thermal conductivity, diamond coating quality and thickness of metallised layer were carried out.",
author = "Jyh-Ming Ting and Lake, {M. L.}",
year = "1995",
month = "2",
day = "1",
doi = "10.1108/eb044583",
language = "English",
volume = "12",
pages = "30--31",
journal = "Microelectronics International",
issn = "1356-5362",
publisher = "Emerald Group Publishing Ltd.",
number = "2",

}

A Novel Composite Material for Electronic Packaging. / Ting, Jyh-Ming; Lake, M. L.

In: Microelectronics International: An International Journal, Vol. 12, No. 2, 01.02.1995, p. 30-31.

Research output: Contribution to journalReview article

TY - JOUR

T1 - A Novel Composite Material for Electronic Packaging

AU - Ting, Jyh-Ming

AU - Lake, M. L.

PY - 1995/2/1

Y1 - 1995/2/1

N2 - A novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metailic layer(s) on the diamond surface is described in this paper. The carbon/carbon composite was processed by pitch infiltration into vapour grown carbon fibre preform. Diamond coatings were then applied to the composite using a microwave enhanced chemical vapour deposition technique. Surface metallisation on the diamond coatings was performed using an electron beam evaporation technique. Characterisations including microstructure, thermal conductivity, diamond coating quality and thickness of metallised layer were carried out.

AB - A novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metailic layer(s) on the diamond surface is described in this paper. The carbon/carbon composite was processed by pitch infiltration into vapour grown carbon fibre preform. Diamond coatings were then applied to the composite using a microwave enhanced chemical vapour deposition technique. Surface metallisation on the diamond coatings was performed using an electron beam evaporation technique. Characterisations including microstructure, thermal conductivity, diamond coating quality and thickness of metallised layer were carried out.

UR - http://www.scopus.com/inward/record.url?scp=84948222339&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84948222339&partnerID=8YFLogxK

U2 - 10.1108/eb044583

DO - 10.1108/eb044583

M3 - Review article

VL - 12

SP - 30

EP - 31

JO - Microelectronics International

JF - Microelectronics International

SN - 1356-5362

IS - 2

ER -