A Novel Composite Material for Electronic Packaging

Engineering & Materials Science

• Electronics packaging 90%
• Diamonds 70%
• Composite materials 41%
• Carbon carbon composites 40%
• Coatings 31%
• Electron beams 16%
• Infiltration 16%
• Chemical vapor deposition 16%
• Metallizing 16%
• Heat sinks 15%
• Evaporation 14%
• Thermal conductivity 12%
• Vapors 12%
• Microwaves 12%
• Characterization (materials science) 12%
• Microstructure 9%

Physics & Astronomy

• electronic packaging 100%
• diamonds 56%
• composite materials 43%
• carbon-carbon composites 42%
• coatings 28%
• heat sinks 16%
• preforms 16%
• infiltration 16%
• carbon fibers 15%
• thermal conductivity 11%
• vapor deposition 10%
• evaporation 10%
• vapors 10%
• electron beams 10%
• microwaves 9%
• microstructure 8%
• characterization 7%

Chemical Compounds

• Diamond 67%
• Composite Material 35%
• Carbon Atom 26%
• Electron Beam Evaporation 21%
• Deposition Technique 15%
• Thermal Conductivity 13%
• Carbon Fiber 12%
• Chemical Vapour Deposition 12%
• Dielectric Material 12%
• Microwave 11%
• Microstructure 9%
• Surface 9%