A novel dielectrophoresis-based microfluidic chip for antibody-free isolation of circulating tumor cells from blood

I. Fang Cheng, Tzu Ying Chen, Yu De Lin, Wei Lung Huang, Chien Wei Liu, Wu Chou Su

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

An antibody-free approach for high purity and high throughput isolation of circulating tumor cells (CTCs) from human blood in a microfluidic chip is presented. High throughput continuous CTC isolation (>1.2 ml/hr) is achieved with a sustained dielectrophoresis (DEP) particle force normal to the continuous through-flow. The design allows continuous fractionation of cells into different downstream sub-channels based on the differences in their different critical DEP strengths/mobility on both sides of the cross-over. An enrichment factor of ∼105 and a recovery rate of ∼80% from a 0.001% CTC sample is achieved at a high throughput of 1.2 ml/hr. Compared to conventional physical methods, such as immunomagnetics-based methods and microfluidic biomarker-based methods, the isolation purity, recovery rate, throughput and viability of the proposed antibody-free chip demonstrated excellent capabilities, especially with regard to high enrichment at a high flow rate.

Original languageEnglish
Title of host publicationIEEE-NANO 2015 - 15th International Conference on Nanotechnology
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1525-1527
Number of pages3
ISBN (Electronic)9781467381550
DOIs
Publication statusPublished - 2015
Event15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015 - Rome, Italy
Duration: 2015 Jul 272015 Jul 30

Publication series

NameIEEE-NANO 2015 - 15th International Conference on Nanotechnology

Other

Other15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015
Country/TerritoryItaly
CityRome
Period15-07-2715-07-30

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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