A Novel Experimental System for Characterizing Interface Delamination under Mixed-Mode Fatigue Loading

Tz Cheng Chiu, Wei Lu, Chi An Hua, Chia Kuei Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A mixed mode bending experimental system is developed for quantifying the subcritical debond growth behavior and establishing the fatigue crack growth rate models for materials interfaces of interest under a full spectrum of loading mode mixity. In the fatigue debond growth experiment, the control program calculates and adjusts the applied bending forces to maintain a constant phase angle at the prescribed value. The relationship between crack growth rate and the applied strain energy release rate is obtained by post-processing the experimental results with analytically derived equations. Fatigue growth characteristics of the Al-epoxy interface under various mode mixities were investigated. The steady-state cyclic fatigue delamination growth is found to exhibit a power-law dependence on the applied strain energy release rate range. A phase-Angle dependent fatigue crack growth model was constructed from fitting the steady-state cyclic fatigue delamination growth responses. The subcritical debond growth model can be combined with delamination driving forces obtained for real structures containing the interface of interest to predict the fatigue crack growth behavior and the corresponding structural reliability.

Original languageEnglish
Title of host publicationProceedings - ECTC 2016
Subtitle of host publication66th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1970-1976
Number of pages7
ISBN (Electronic)9781509012039
DOIs
Publication statusPublished - 2016 Aug 16
Event66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
Duration: 2016 May 312016 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2016-August
ISSN (Print)0569-5503

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
CountryUnited States
CityLas Vegas
Period16-05-3116-06-03

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Chiu, T. C., Lu, W., Hua, C. A., & Hsu, C. K. (2016). A Novel Experimental System for Characterizing Interface Delamination under Mixed-Mode Fatigue Loading. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (pp. 1970-1976). [7545693] (Proceedings - Electronic Components and Technology Conference; Vol. 2016-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.117