A novel fabrication for pressure sensor with polymer material and its characteristic testing

H. S. Ko, C. W. Liu, Chie Gau

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In the current fabrication of pressure sensor, both the sensor cavity and the sensor diaphragm were made of SU-8 which can be readily spun coat on the substrate at desired thickness and patterned by lithography. The thickness of the diaphragm, and the height of the sensor cavities, allowing deformation of diaphragm, can be readily varied from few to hundreds of microns by spin coat different thickness of SU-8 layer. This allows fabrication of cavity with much greater heights and measurement of pressure with much wider range. However, the sensor material used for the pressure sensor is the polysilicon doped with a high concentration of boron, which can readily sense the deformation of a diaphragm. This has precluded the possibility of fabricating the cavities and diaphragm first - which is a low temperature process, and then depositing the polysilicon sensor on the above - which is a high temperature process. Fabrication strategy has to be reversed, i.e., starts with the high temperature process of depositing the doped polysilicon layer and then the low temperature process.

Original languageEnglish
Title of host publicationProceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Pages561-566
Number of pages6
DOIs
Publication statusPublished - 2007 Aug 28
Event2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand
Duration: 2007 Jan 162007 Jan 19

Publication series

NameProceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007

Other

Other2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
CountryThailand
CityBangkok
Period07-01-1607-01-19

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'A novel fabrication for pressure sensor with polymer material and its characteristic testing'. Together they form a unique fingerprint.

Cite this