A novel halogen-free, phosphorous-free and heat resistant material for copper clad laminate

Chia Yu Liu, June Che Lu, Su Wen Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Brominated and phosphorous-containing type epoxy resins are important binders for current flame retardant CCL (copper clad laminate).Nevertheless, they will cause environment problems. Brominated type resins will generate dioxins from inappropriate incineration condition and phosphorous type resins may cause the pollution of aquatic environment. On July 1, 2006, two important directives on environment protection were released by European Union, i.e., RoHS and WEEE. The Sn-Pb solder should be replaced by lead free type solder and the IR Reflow will increase from 200°C to 255°C. Given the above, we developed a new halogen-free and phosphorous-free composition, which is comprising nitrogen-containing resin, inorganic filler and modifier .The nitrogen and inorganic filler impart CCL with flame-retardant properties and render CCL more environment-friendly. The new product is also good in heat properties and can meet the specification of IPC4101B.

Original languageEnglish
Title of host publication2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
Pages171-173
Number of pages3
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Other

Other2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

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All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Liu, C. Y., Lu, J. C., & Hsu, S. W. (2008). A novel halogen-free, phosphorous-free and heat resistant material for copper clad laminate. In 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 (pp. 171-173). [4783836] (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008). https://doi.org/10.1109/IMPACT.2008.4783836