A novel liquid thermal polymerization resist for nanoimprint lithography with low shrinkage and high flowability

Wen Chang Liao, Lien-Chung Hsu

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

A novel liquid thermal polymerization resist was prepared for nanoimprint lithography on flexible plastic substrates. The resist is a mixture of poly(methyl methacrylate) (PMMA), methylmethacrylate (MMA), n-butylacrylate (n-BA), methacrylic acid (MAA) and 2,2′-azobisisobutyronitrile (AIBN). The resist can be imprinted at room temperature with a pressure of 1.2 MPa, and then cured at 95°C to obtain nano-scaled and micro-scaled patterns. Replications of high-density line and space patterns with resolutions of 50 and 100 nm were obtained on a flexible ITO/PET substrate. The liquid resist has low viscosity, and shows a near-zero residual layer at the bottom of the pattern. Due to the addition of PMMA as the binder, the shrinkage of the resist after curing is only 2.01%.

Original languageEnglish
Article number065303
JournalNanotechnology
Volume18
Issue number6
DOIs
Publication statusPublished - 2007 Feb 14

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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