TY - JOUR
T1 - A novel localized-trapped-charge-induced threshold voltage model for double-fin multi-channel FETs (DFMcFETs)
AU - Gao, Hong Wun
AU - Wang, Yeong Her
AU - Chiang, Te Kuang
N1 - Funding Information:
This work was supported by the Ministry of Science and Technology (MOST) under Grant MOST 104-2221-E-390-014.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/6
Y1 - 2017/6
N2 - With the effects of localized trapped charges on the flat-band voltage, a novel localized-trapped-chargeinduced threshold voltage model for the double-fin multi-channel FET (DFMcFET) is presented based on the quasi-3-D scaling equation and minimum bottom-central potential. It is shown that the deep trench of the DFMcFET is superior to the shallow one in respect of reducing the localized-trapped-charge-induced threshold voltage degradation (LTTVD). Besides, the low drain voltage Vds, the low trapped charge density Nf , the small damaged zone near the drain side Ls and the thin gate oxide tox are required to resist LTTVD as the normalized damaged zone is increased. The LTTVD can be well controlled by the scaling theory. With the fixed damaged zone and trapped charge density, the allowable minimum channel length can be uniquely determined according to the criterion of scaling factor. In comparison to the conventional FinFET, DFMcFET not only provides more conducting channel, but also suffers less threshold voltage degradation caused by the short-channel effects irrespective of trapped charge polarity. With its computational efficiency and simple form, the model can be easily used for the circuit application for DFMcFET.
AB - With the effects of localized trapped charges on the flat-band voltage, a novel localized-trapped-chargeinduced threshold voltage model for the double-fin multi-channel FET (DFMcFET) is presented based on the quasi-3-D scaling equation and minimum bottom-central potential. It is shown that the deep trench of the DFMcFET is superior to the shallow one in respect of reducing the localized-trapped-charge-induced threshold voltage degradation (LTTVD). Besides, the low drain voltage Vds, the low trapped charge density Nf , the small damaged zone near the drain side Ls and the thin gate oxide tox are required to resist LTTVD as the normalized damaged zone is increased. The LTTVD can be well controlled by the scaling theory. With the fixed damaged zone and trapped charge density, the allowable minimum channel length can be uniquely determined according to the criterion of scaling factor. In comparison to the conventional FinFET, DFMcFET not only provides more conducting channel, but also suffers less threshold voltage degradation caused by the short-channel effects irrespective of trapped charge polarity. With its computational efficiency and simple form, the model can be easily used for the circuit application for DFMcFET.
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U2 - 10.1109/TDMR.2017.2669094
DO - 10.1109/TDMR.2017.2669094
M3 - Article
AN - SCOPUS:85025662308
SN - 1530-4388
VL - 17
SP - 291
EP - 297
JO - IEEE Transactions on Device and Materials Reliability
JF - IEEE Transactions on Device and Materials Reliability
IS - 2
M1 - 7855657
ER -