A novel mechanism of silver microflakes sinter joining

Hao Zhang, Shijo Nagao, Shih Kang Lin, Emi Yokoi, Chuantong Chen, Katsuaki Suganuma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the combination of this novel mechanism and low-temperature diffusion bonding.

Original languageEnglish
Title of host publicationChina Semiconductor Technology International Conference 2016, CSTIC 2016
EditorsHanming Wu, Hsiang-Lan Lung, Ying Shi, Dong Chen, David Huang, Qi Wang, Kuochun Wu, Ying Zhang, Cor Claeys, Steve Liang, Ru Huang, Beichao Zhang, Peilin Song, Jiang Yan, Qinghuang Lin, Kafai Lai
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467388047
DOIs
Publication statusPublished - 2016 May 2
EventChina Semiconductor Technology International Conference, CSTIC 2016 - Shanghai, China
Duration: 2016 Mar 132016 Mar 14

Publication series

NameChina Semiconductor Technology International Conference 2016, CSTIC 2016

Other

OtherChina Semiconductor Technology International Conference, CSTIC 2016
CountryChina
CityShanghai
Period16-03-1316-03-14

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Process Chemistry and Technology

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