@inproceedings{b3fb91de3c434e0aaf63b09b82846d4b,
title = "A novel mechanism of silver microflakes sinter joining",
abstract = "In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the combination of this novel mechanism and low-temperature diffusion bonding.",
author = "Hao Zhang and Shijo Nagao and Lin, {Shih Kang} and Emi Yokoi and Chuantong Chen and Katsuaki Suganuma",
note = "Funding Information: The present study is partially supported by the Japan Society for the Promotion of Science (Grant- in-Aid for Scientific Research, Grant No. 24226017) Publisher Copyright: {\textcopyright} 2016 IEEE. Copyright: Copyright 2016 Elsevier B.V., All rights reserved.; China Semiconductor Technology International Conference, CSTIC 2016 ; Conference date: 13-03-2016 Through 14-03-2016",
year = "2016",
month = may,
day = "2",
doi = "10.1109/CSTIC.2016.7463950",
language = "English",
series = "China Semiconductor Technology International Conference 2016, CSTIC 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Hanming Wu and Hsiang-Lan Lung and Ying Shi and Dong Chen and David Huang and Qi Wang and Kuochun Wu and Ying Zhang and Cor Claeys and Steve Liang and Ru Huang and Beichao Zhang and Peilin Song and Jiang Yan and Qinghuang Lin and Kafai Lai",
booktitle = "China Semiconductor Technology International Conference 2016, CSTIC 2016",
address = "United States",
}