A novel mechanism of silver microflakes sinter joining

Hao Zhang, Shijo Nagao, Shih-kang Lin, Emi Yokoi, Chuantong Chen, Katsuaki Suganuma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the combination of this novel mechanism and low-temperature diffusion bonding.

Original languageEnglish
Title of host publicationChina Semiconductor Technology International Conference 2016, CSTIC 2016
EditorsHanming Wu, Hsiang-Lan Lung, Ying Shi, Dong Chen, David Huang, Qi Wang, Kuochun Wu, Ying Zhang, Cor Claeys, Steve Liang, Ru Huang, Beichao Zhang, Peilin Song, Jiang Yan, Qinghuang Lin, Kafai Lai
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467388047
DOIs
Publication statusPublished - 2016 May 2
EventChina Semiconductor Technology International Conference, CSTIC 2016 - Shanghai, China
Duration: 2016 Mar 132016 Mar 14

Publication series

NameChina Semiconductor Technology International Conference 2016, CSTIC 2016

Other

OtherChina Semiconductor Technology International Conference, CSTIC 2016
CountryChina
CityShanghai
Period16-03-1316-03-14

Fingerprint

Silver
Joining
Sintering
Diffusion bonding
Nucleation
Transmission electron microscopy
Temperature

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Process Chemistry and Technology

Cite this

Zhang, H., Nagao, S., Lin, S., Yokoi, E., Chen, C., & Suganuma, K. (2016). A novel mechanism of silver microflakes sinter joining. In H. Wu, H-L. Lung, Y. Shi, D. Chen, D. Huang, Q. Wang, K. Wu, Y. Zhang, C. Claeys, S. Liang, R. Huang, B. Zhang, P. Song, J. Yan, Q. Lin, ... K. Lai (Eds.), China Semiconductor Technology International Conference 2016, CSTIC 2016 [7463950] (China Semiconductor Technology International Conference 2016, CSTIC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CSTIC.2016.7463950
Zhang, Hao ; Nagao, Shijo ; Lin, Shih-kang ; Yokoi, Emi ; Chen, Chuantong ; Suganuma, Katsuaki. / A novel mechanism of silver microflakes sinter joining. China Semiconductor Technology International Conference 2016, CSTIC 2016. editor / Hanming Wu ; Hsiang-Lan Lung ; Ying Shi ; Dong Chen ; David Huang ; Qi Wang ; Kuochun Wu ; Ying Zhang ; Cor Claeys ; Steve Liang ; Ru Huang ; Beichao Zhang ; Peilin Song ; Jiang Yan ; Qinghuang Lin ; Kafai Lai. Institute of Electrical and Electronics Engineers Inc., 2016. (China Semiconductor Technology International Conference 2016, CSTIC 2016).
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title = "A novel mechanism of silver microflakes sinter joining",
abstract = "In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the combination of this novel mechanism and low-temperature diffusion bonding.",
author = "Hao Zhang and Shijo Nagao and Shih-kang Lin and Emi Yokoi and Chuantong Chen and Katsuaki Suganuma",
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doi = "10.1109/CSTIC.2016.7463950",
language = "English",
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publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Hanming Wu and Hsiang-Lan Lung and Ying Shi and Dong Chen and David Huang and Qi Wang and Kuochun Wu and Ying Zhang and Cor Claeys and Steve Liang and Ru Huang and Beichao Zhang and Peilin Song and Jiang Yan and Qinghuang Lin and Kafai Lai",
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Zhang, H, Nagao, S, Lin, S, Yokoi, E, Chen, C & Suganuma, K 2016, A novel mechanism of silver microflakes sinter joining. in H Wu, H-L Lung, Y Shi, D Chen, D Huang, Q Wang, K Wu, Y Zhang, C Claeys, S Liang, R Huang, B Zhang, P Song, J Yan, Q Lin & K Lai (eds), China Semiconductor Technology International Conference 2016, CSTIC 2016., 7463950, China Semiconductor Technology International Conference 2016, CSTIC 2016, Institute of Electrical and Electronics Engineers Inc., China Semiconductor Technology International Conference, CSTIC 2016, Shanghai, China, 16-03-13. https://doi.org/10.1109/CSTIC.2016.7463950

A novel mechanism of silver microflakes sinter joining. / Zhang, Hao; Nagao, Shijo; Lin, Shih-kang; Yokoi, Emi; Chen, Chuantong; Suganuma, Katsuaki.

China Semiconductor Technology International Conference 2016, CSTIC 2016. ed. / Hanming Wu; Hsiang-Lan Lung; Ying Shi; Dong Chen; David Huang; Qi Wang; Kuochun Wu; Ying Zhang; Cor Claeys; Steve Liang; Ru Huang; Beichao Zhang; Peilin Song; Jiang Yan; Qinghuang Lin; Kafai Lai. Institute of Electrical and Electronics Engineers Inc., 2016. 7463950 (China Semiconductor Technology International Conference 2016, CSTIC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - A novel mechanism of silver microflakes sinter joining

AU - Zhang, Hao

AU - Nagao, Shijo

AU - Lin, Shih-kang

AU - Yokoi, Emi

AU - Chen, Chuantong

AU - Suganuma, Katsuaki

PY - 2016/5/2

Y1 - 2016/5/2

N2 - In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the combination of this novel mechanism and low-temperature diffusion bonding.

AB - In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the combination of this novel mechanism and low-temperature diffusion bonding.

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U2 - 10.1109/CSTIC.2016.7463950

DO - 10.1109/CSTIC.2016.7463950

M3 - Conference contribution

AN - SCOPUS:84974602938

T3 - China Semiconductor Technology International Conference 2016, CSTIC 2016

BT - China Semiconductor Technology International Conference 2016, CSTIC 2016

A2 - Wu, Hanming

A2 - Lung, Hsiang-Lan

A2 - Shi, Ying

A2 - Chen, Dong

A2 - Huang, David

A2 - Wang, Qi

A2 - Wu, Kuochun

A2 - Zhang, Ying

A2 - Claeys, Cor

A2 - Liang, Steve

A2 - Huang, Ru

A2 - Zhang, Beichao

A2 - Song, Peilin

A2 - Yan, Jiang

A2 - Lin, Qinghuang

A2 - Lai, Kafai

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Zhang H, Nagao S, Lin S, Yokoi E, Chen C, Suganuma K. A novel mechanism of silver microflakes sinter joining. In Wu H, Lung H-L, Shi Y, Chen D, Huang D, Wang Q, Wu K, Zhang Y, Claeys C, Liang S, Huang R, Zhang B, Song P, Yan J, Lin Q, Lai K, editors, China Semiconductor Technology International Conference 2016, CSTIC 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7463950. (China Semiconductor Technology International Conference 2016, CSTIC 2016). https://doi.org/10.1109/CSTIC.2016.7463950