A novel multiphysics sensoring method based on thermal and EC techniques and its application for crack inspection

Cheng-Chi Tai, Yen Lin Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Crack inspection is a critical issue in quantitative nondestructive evaluation (NDE). The eddy current (EC) method is effective for surface discontinuities detection, but the spatial resolution of conventional EC method is constrained by the size of EC probe. The photoinductive (PI) imaging method is a NDE technique that combines EC and laser-based thermal imaging methods. It had been clearly demonstrated that PI method is a high-resolution technique from practical experiments. In this paper, the numerical multiphysics simulation of PI imaging have been performed with 2D transient using the finite element method (FEM) to characterize corner cracks at the edge of a Ti-6Al-4V bolt hole specimen. The FEM simulation results of 0.25-mm, 0.50-mm, and 0.75-mm rectangular notches are showed and discussed. The results show that the PI imaging has higher spatial resolution in the area of the defect in 2D models as compared with the conventional EC images. We demonstrate that the PI method is a novel sensoring method for characterizing the geometric shape of cracks.

Original languageEnglish
Title of host publication2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008
Pages475-479
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008 - Taichung, Taiwan
Duration: 2008 Jun 112008 Jun 13

Other

Other2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008
CountryTaiwan
CityTaichung
Period08-06-1108-06-13

Fingerprint

Eddy currents
Inspection
Cracks
Imaging techniques
Finite element method
Infrared imaging
Bolts
Hot Temperature
Defects
Lasers
Computer simulation
Experiments

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Tai, C-C., & Pan, Y. L. (2008). A novel multiphysics sensoring method based on thermal and EC techniques and its application for crack inspection. In 2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008 (pp. 475-479). [4545805] https://doi.org/10.1109/SUTC.2008.53
Tai, Cheng-Chi ; Pan, Yen Lin. / A novel multiphysics sensoring method based on thermal and EC techniques and its application for crack inspection. 2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008. 2008. pp. 475-479
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abstract = "Crack inspection is a critical issue in quantitative nondestructive evaluation (NDE). The eddy current (EC) method is effective for surface discontinuities detection, but the spatial resolution of conventional EC method is constrained by the size of EC probe. The photoinductive (PI) imaging method is a NDE technique that combines EC and laser-based thermal imaging methods. It had been clearly demonstrated that PI method is a high-resolution technique from practical experiments. In this paper, the numerical multiphysics simulation of PI imaging have been performed with 2D transient using the finite element method (FEM) to characterize corner cracks at the edge of a Ti-6Al-4V bolt hole specimen. The FEM simulation results of 0.25-mm, 0.50-mm, and 0.75-mm rectangular notches are showed and discussed. The results show that the PI imaging has higher spatial resolution in the area of the defect in 2D models as compared with the conventional EC images. We demonstrate that the PI method is a novel sensoring method for characterizing the geometric shape of cracks.",
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Tai, C-C & Pan, YL 2008, A novel multiphysics sensoring method based on thermal and EC techniques and its application for crack inspection. in 2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008., 4545805, pp. 475-479, 2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008, Taichung, Taiwan, 08-06-11. https://doi.org/10.1109/SUTC.2008.53

A novel multiphysics sensoring method based on thermal and EC techniques and its application for crack inspection. / Tai, Cheng-Chi; Pan, Yen Lin.

2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008. 2008. p. 475-479 4545805.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Tai C-C, Pan YL. A novel multiphysics sensoring method based on thermal and EC techniques and its application for crack inspection. In 2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing, SUTC 2008. 2008. p. 475-479. 4545805 https://doi.org/10.1109/SUTC.2008.53